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CRCW120612R7FKTA PDF预览

CRCW120612R7FKTA

更新时间: 2022-09-29 12:35:33
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
8页 127K
描述
RES SMD 12.7 OHM 1% 1/4W 1206

CRCW120612R7FKTA 数据手册

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D/CRCW  
Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors  
Vishay  
TEST PROCEDURES AND REQUIREMENTS  
REQUIREMENTS PERMISSIBLE  
CHANGE (ΔR)  
PROCEDURE  
IEC  
EN  
STABILITY CLASS 1 STABILITY CLASS 2  
60082-2  
OR BETTER  
1 Ω to 10 MΩ  
1 %  
OR BETTER  
1 Ω to 10 MΩ  
5 %  
60115-1  
CLAUSE  
TEST  
TEST  
METHOD  
Stability for product types:  
D/CRCW  
4.5  
4.7  
-
-
Resistance  
-
Voltage proof  
U = 1.4 · Uins; 60 s  
No flashover or breakdown  
U = 2.5 x P70 x R 2 x Umax.  
;
4.13  
-
Short time overload  
(0.25 % R + 0.05 Ω)  
(0.5 % R + 0.05 Ω)  
duration: Acc. to style  
Solder bath method; Sn60Pb40;  
non-activated flux;  
Good tinning (95 %  
covered);  
4.17.2  
58 (Td)  
Solderability  
(235 5) °C, (2 0.2) s  
no visible damage  
(20/- 55/20) °C and  
(20/125/20) °C  
4.8.4.2  
4.32  
-
Temperature coefficient  
Shear (adhesion)  
100 ppm/K  
200 ppm/K  
RR 1608 and smaller: 9 N  
RR 2012 and larger: 45 N  
21 (Uu3)  
No visible damage  
No visible damage,  
no open circuit in bent position  
(0.25 % R + 0.05 Ω)  
4.33  
4.19  
21 (Uu1)  
14 (Na)  
Substrate bending  
Depth 2 mm; 3 times  
30 min. at - 55 °C;  
30 min. at 125°C  
Rapid change of temperature  
5 cycles  
1000 cycles  
(0.25 % R + 0.05 Ω)  
(1 % R + 0.05 Ω)  
(0.5 % R + 0.05 Ω)  
(1 % R + 0.05 Ω)  
4.23  
-
Climatic sequence:  
Dry heat  
-
4.23.2  
2 (Ba)  
125 °C; 16 h  
55 °C; 90 % RH;  
4.23.3  
30 (Db)  
Damp heat, cyclic  
24 h; 1 cycle  
4.23.4  
4.23.5  
1 (Aa)  
13 (M)  
Cold  
- 55 °C; 2 h  
(1 % R + 0.05 Ω)  
(2 % R + 0.1 Ω)  
Low air pressure  
1 kPa; (25 10) °C; 1 h  
55 °C; 90 % RH;  
24 h; 5 cycles  
4.23.6  
4.23.7  
30 (Db)  
-
Damp heat, cyclic  
DC load  
U = P70 x R  
U = (P70 x R) Umax.  
1.5 h on; 0.5 h off;  
70 °C; 1000 h  
4.25.1  
-
Endurance at 70 °C  
(1 % R + 0.05 Ω)  
(2 % R + 0.1 Ω)  
(2 % R + 0.1 Ω)  
(4 % R + 0.1 Ω)  
70 °C; 8000 h  
Solder bath method  
(260 5) °C; (10 1) s  
4.18.2  
4.35  
58 (Td)  
Resistance to soldering heat  
Flamability, needle flame test  
Damp heat, steady state  
(0.25 % R + 0.05 Ω)  
(0.5 % R + 0.05 Ω)  
IEC 60695-11-5;  
10 s  
-
No burning after 30 s  
(1 % R + 0.05 Ω)  
(1 % R + 0.05 Ω) (2 % R + 0.1 Ω)  
(40 2) °C;  
(93 3) % RH; 56 days  
4.24  
78 (Cab)  
-
Endurance at upper  
category temperature  
4.25.3  
155 °C; 1000 h  
IEC 61340-3-1;  
3 pos. + 3 neg. discharges;  
ESD test voltage acc. to size  
Electrostatic discharge  
(human body model)  
4.40  
-
(1 % R + 0.05 Ω)  
Isopropyl alcohol;  
50 °C; method 2  
4.29  
4.30  
45 (XA) Component solvent resistance  
45 (XA) Solvent resistance of marking  
No visible damage  
Isopropyl alcohol;  
50 °C; method 1, toothbrush  
Marking legible,  
no visible damage  
Document Number: 20008  
Revision: 18-Nov-10  
For technical questions, contact: thickfilmchip@vishay.com  
www.vishay.com  
123  

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