D/CRCW
Lead (Pb)-Bearing Thick Film, Rectangular Chip Resistors
Vishay
TEST PROCEDURES AND REQUIREMENTS
REQUIREMENTS PERMISSIBLE
CHANGE (ΔR)
PROCEDURE
IEC
EN
STABILITY CLASS 1 STABILITY CLASS 2
60082-2
OR BETTER
1 Ω to 10 MΩ
1 %
OR BETTER
1 Ω to 10 MΩ
5 %
60115-1
CLAUSE
TEST
TEST
METHOD
Stability for product types:
D/CRCW
4.5
4.7
-
-
Resistance
-
Voltage proof
U = 1.4 · Uins; 60 s
No flashover or breakdown
U = 2.5 x P70 x R ≤ 2 x Umax.
;
4.13
-
Short time overload
(0.25 % R + 0.05 Ω)
(0.5 % R + 0.05 Ω)
duration: Acc. to style
Solder bath method; Sn60Pb40;
non-activated flux;
Good tinning (≥ 95 %
covered);
4.17.2
58 (Td)
Solderability
(235 5) °C, (2 0.2) s
no visible damage
(20/- 55/20) °C and
(20/125/20) °C
4.8.4.2
4.32
-
Temperature coefficient
Shear (adhesion)
100 ppm/K
200 ppm/K
RR 1608 and smaller: 9 N
RR 2012 and larger: 45 N
21 (Uu3)
No visible damage
No visible damage,
no open circuit in bent position
(0.25 % R + 0.05 Ω)
4.33
4.19
21 (Uu1)
14 (Na)
Substrate bending
Depth 2 mm; 3 times
30 min. at - 55 °C;
30 min. at 125°C
Rapid change of temperature
5 cycles
1000 cycles
(0.25 % R + 0.05 Ω)
(1 % R + 0.05 Ω)
(0.5 % R + 0.05 Ω)
(1 % R + 0.05 Ω)
4.23
-
Climatic sequence:
Dry heat
-
4.23.2
2 (Ba)
125 °C; 16 h
55 °C; ≥ 90 % RH;
4.23.3
30 (Db)
Damp heat, cyclic
24 h; 1 cycle
4.23.4
4.23.5
1 (Aa)
13 (M)
Cold
- 55 °C; 2 h
(1 % R + 0.05 Ω)
(2 % R + 0.1 Ω)
Low air pressure
1 kPa; (25 10) °C; 1 h
55 °C; ≥ 90 % RH;
24 h; 5 cycles
4.23.6
4.23.7
30 (Db)
-
Damp heat, cyclic
DC load
U = P70 x R
U = √(P70 x R) ≤ Umax.
1.5 h on; 0.5 h off;
70 °C; 1000 h
4.25.1
-
Endurance at 70 °C
(1 % R + 0.05 Ω)
(2 % R + 0.1 Ω)
(2 % R + 0.1 Ω)
(4 % R + 0.1 Ω)
70 °C; 8000 h
Solder bath method
(260 5) °C; (10 1) s
4.18.2
4.35
58 (Td)
Resistance to soldering heat
Flamability, needle flame test
Damp heat, steady state
(0.25 % R + 0.05 Ω)
(0.5 % R + 0.05 Ω)
IEC 60695-11-5;
10 s
-
No burning after 30 s
(1 % R + 0.05 Ω)
(1 % R + 0.05 Ω) (2 % R + 0.1 Ω)
(40 2) °C;
(93 3) % RH; 56 days
4.24
78 (Cab)
-
Endurance at upper
category temperature
4.25.3
155 °C; 1000 h
IEC 61340-3-1;
3 pos. + 3 neg. discharges;
ESD test voltage acc. to size
Electrostatic discharge
(human body model)
4.40
-
(1 % R + 0.05 Ω)
Isopropyl alcohol;
50 °C; method 2
4.29
4.30
45 (XA) Component solvent resistance
45 (XA) Solvent resistance of marking
No visible damage
Isopropyl alcohol;
50 °C; method 1, toothbrush
Marking legible,
no visible damage
Document Number: 20008
Revision: 18-Nov-10
For technical questions, contact: thickfilmchip@vishay.com
www.vishay.com
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