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CRA04P083RJPZ PDF预览

CRA04P083RJPZ

更新时间: 2022-12-29 21:33:26
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威世 - VISHAY /
页数 文件大小 规格书
4页 93K
描述
Thick Film Chip Resistor Array

CRA04P083RJPZ 数据手册

 浏览型号CRA04P083RJPZ的Datasheet PDF文件第1页浏览型号CRA04P083RJPZ的Datasheet PDF文件第2页浏览型号CRA04P083RJPZ的Datasheet PDF文件第4页 
CRA04P  
www.vishay.com  
Vishay  
TEST PROCEDURES AND REQUIREMENTS  
IEC  
REQUIREMENTS PERMISSIBLE  
EN  
60115-1  
CLAUSE  
60068-2  
CHANGE (R) (1)  
TEST  
PROCEDURE  
TEST  
METHOD  
STABILITY CLASS 2 OR BETTER  
Stability for product type:  
10 to 1 M  
1 to 1 M  
CRA04P  
4.5  
4.7  
-
-
Resistance  
-
2 ꢀ  
5 ꢀ  
Voltage proof  
U = 1.4 x Uins; 60 s  
U = 2.5 x P70 x R  
2 × Umax.; Duration according to style  
No flashover or breakdown  
4.13  
-
Short time overload  
Solderability  
(0.5 ꢀ R + 0.05 )  
Good tinning (95 ꢀ covered)  
Solder bath method; Sn60Pb40;  
non-activated flux; (235 5) °C; (2 0.2) s  
no visible damage  
4.17.2  
58 (Td)  
-
Good tinning (95 ꢀ covered)  
Solder bath method; Sn96.5Ag3Cu0.5;  
non-activated flux; (245 5) °C; (3 0.3) s  
no visible damage  
4.8.4.2  
4.32  
Temperature coefficient  
Shear (adhesion)  
(20/- 55/20) °C and (20/125/20) °C  
45 N  
100 ppm/K  
200 ppm/K  
21 (UU3  
)
No visible damage  
No visible damage,  
no open circuit in bent position  
(0.25 ꢀ R + 0.05 )  
4.33  
4.19  
21 (UU1  
)
Substrate bending  
Depth 2 mm; 3 times  
30 min. at - 55 °C; 30 min at 125 °C  
14 (Na)  
Rapid change of temperature  
5 cycles  
1000 cycles  
(0.5 ꢀ R + 0.05 )  
(1 ꢀ R + 0.05 )  
4.23  
-
Dry heat  
Damp heat, cyclic  
Cold  
-
4.23.2  
4.23.3  
4.23.4  
4.23.5  
4.23.6  
4.23.7  
2 (Ba)  
30 (Db)  
1 (Aa)  
13 (M)  
30 (Db)  
-
125 °C; 16 h  
55 °C; 90 ꢀ RH; 24 h; 1 cycle  
- 55 °C; 2 h  
Low air pressure  
-
(2 ꢀ R + 0.05 )  
1 kPa; (25 10) °C; 1 h  
55 °C; 90 ꢀ RH; 24 h; 5 cycle  
U = P70 x R  
Damp heat, cyclic  
D.C. load  
U = P70 x R Umax.  
1.5 h on; 0.5 h off;  
70 °C; 1000 h  
4.25.1  
-
Endurance at 70 °C  
(2 ꢀ R + 0.1 )  
(4 ꢀ R + 0.1 )  
70 °C; 8000 h  
4.18.2  
4.35  
58 (Td)  
-
Resistance to soldering heat  
Flammability, needle flame test  
Damp heat, steady state  
Solder bath method; (260 5) °C; (10 1) s  
IEC 60695-11-5; 10 s  
(0.5 ꢀ R + 0.05 )  
No burning after 30 s  
(1 ꢀ R + 0.05 )  
4.24  
78 (Cab)  
(40 2) °C; (93 3) ꢀ RH; 56 days  
Endurance at  
upper category temperature  
4.25.3  
-
155 °C; 1000 h  
(2 ꢀ R + 0.1 )  
Electrostatic discharge  
(human body model)  
IEC 61340-3-1; 3 positive and 3 negative  
discharges; ESD voltage according to style  
4.40  
4.29  
4.30  
-
(1 ꢀ R + 0.05 )  
45 (XA)  
45 (XA)  
Component solvent resistance  
Isopropyl alcohol; 50 °C; method 2  
No visible damage  
Isopropyl alcohol; 50 °C; method 1;  
toothbrush  
Marking legible,  
no visible damage  
Solvent resistance of marking  
f = 10 Hz to 2000 Hz; x, y, z 1.5 mm;  
A 200 m/s2; 10 sweeps per axis  
4.22  
4.37  
6 (Fc)  
Vibration, endurance by sweeping  
Periodic electric overload  
(0.5 ꢀ R + 0.05 )  
(1 ꢀ R + 0.05 )  
(1 ꢀ R + 0.05 )  
U = 15 x P70 x R 2 x Umax.  
0.1 s on; 2.5 s off; 1000 cycles  
-
-
Single pulse high voltage overload,  
10 μs/700 μs  
Û = 10 x P70 x R 2 x Umax.  
4.27  
10 pulses  
Note  
(1) Figures are given for a single element.  
All tests are carried out in accordance with the following specifications:  
• EN 60115-1, generic specification  
• EN 140400, sectional specification  
• EN 140401-802, detail specification  
• IEC 60068-2, environmental test procedures  
Packaging of components is done in paper or blister tapes according to IEC 60286-3.  
Revision: 24-Jun-13  
Document Number: 31048  
3
For technical questions, contact: thickfilmchip@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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