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CP591-2N2907A-WS PDF预览

CP591-2N2907A-WS

更新时间: 2024-09-29 18:13:47
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CENTRAL /
页数 文件大小 规格书
2页 206K
描述
Transistor

CP591-2N2907A-WS 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:compliant风险等级:5.84
Base Number Matches:1

CP591-2N2907A-WS 数据手册

 浏览型号CP591-2N2907A-WS的Datasheet PDF文件第2页 
TM  
PROCESS CP591  
Small Signal Transistor  
PNP - Amp/Switch Transistor Chip  
Central  
Semiconductor Corp.  
PROCESS DETAILS  
Process  
EPITAXIAL PLANAR  
Die Size  
Die Thickness  
19 x 19 MILS  
9.0 MILS  
Base Bonding Pad Area  
Emitter Bonding Pad Area  
Top Side Metalization  
Back Side Metalization  
3.5 x 4.3 MILS  
3.5 x 4.5 MILS  
Al - 30,000Å  
Au - 18,000Å  
GEOMETRY  
GROSS DIE PER 4 INCH WAFER  
30,600  
PRINCIPAL DEVICE TYPES  
2N2905A  
2N2907A  
CMPT2907A  
CMST2907A  
CXT2907A  
CZT2907A  
PN2907A  
BACKSIDE COLLECTOR  
145 Adams Avenue  
Hauppauge, NY 11788 USA  
Tel: (631) 435-1110  
Fax: (631) 435-1824  
www.centralsemi.com  
R3 (1-August 2002)