Datasheet > CL32R122KDBC

CL32R122KDBC

更新时间： 2023-06-15 00:00:00

品牌	Logo	应用领域
三星 - SAMSUNG		/
页数	文件大小	规格书
9页	252K
描述
Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, R2H, -220ppm/Cel TC, 0.0012uF, 1210,

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数据手册

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CL32R122KDBC 数据手册

ꢁCardboard Paper Tape

PACKAGING

SPECIFICATIONS

Feeding round holes

Perforated square

holes for inserting a chip

Unit: mm

Symbol

Type

0.65 1.10

±0.1 ±0.1

2.0

1.0

±0.05 ±0.05

1.10 1.90

±0.2 ±0.2

Dimen-

sion

+0.1

–0

1.5

1.1

max

2.0

±0.05

8.0

3.5 1.75

4.0

±0.1

±0.3 ±0.05 ±0.1 ±0.1

2.4

±0.2

1.16

±0.2

3.6

±0.2

2.0

±0.2

ꢁEmbossed Plastic Tape

Feeding round holes

Perforated square

holes for inserting a chip

Unit: mm

Symbol

Type

1.45

±0.2 ±0.2

2.3

2.0

3.6

8.0

±0.3

3.5

±0.05

4.0

±0.1

0.6

BEL

1.5 2.5

±0.2 ±0.2

Dimen-

sion

+0.1 max

–0

4.0

±0.1

2.0

±0.05

1.75

±0.1

3.6

2.9

±0.2

8.0

±0.1

3.8

max

5.6

±0.05

12.0

±0.3

4.9

±0.2

3.6

±0.2

1...5 6 789

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