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CL31F105ZBFNNNE PDF预览

CL31F105ZBFNNNE

更新时间: 2024-02-10 02:52:44
品牌 Logo 应用领域
三星 - SAMSUNG /
页数 文件大小 规格书
2页 80K
描述
SPECIFICATION

CL31F105ZBFNNNE 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:compliant风险等级:5.84
电容:1 µF电容器类型:CERAMIC CAPACITOR
介电材料:CERAMIC高度:1.6 mm
JESD-609代码:e3长度:3.2 mm
多层:Yes负容差:20%
端子数量:2最高工作温度:85 °C
最低工作温度:-30 °C封装形式:SMT
包装方法:TR, Paper, 13 Inch正容差:80%
额定(直流)电压(URdc):10 V系列:CL31 (Y5V,10V,1.6)
尺寸代码:1206温度特性代码:Y5V
温度系数:-20/+80ppm/Cel ppm/ °C端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier
宽度:1.6 mm

CL31F105ZBFNNNE 数据手册

 浏览型号CL31F105ZBFNNNE的Datasheet PDF文件第2页 
SPECIFICATION  
CL31F105ZBFNNNE  
Supplier : Samsung electro-mechanics  
Product : Multi-layer Ceramic Capacitor  
Samsung P/N :  
Descriptiont :  
CAP, 1, -20+80%, 50V, Y5V, 1206  
A. Samsung Part Number  
CL 31  
F
105  
Z
B
F
N
N
N
E
Series  
Size  
SamsungꢀMultiꢁlayerꢀCeramicꢀCapacitor  
1.6  
1206 (inchꢀcode)  
L: 3.2 ±ꢀ0.15  
mm  
W:  
±ꢀ0.15 mm  
Ni  
Cu  
Dielectric  
Capacitance  
Capacitance  
tolerance  
Y5V  
Inner electrode  
Termination  
Plating  
1
Snꢀ100%  
Normal  
ꢁ20/+80 %  
(PbꢀFree)  
Product  
Special  
Rated Voltage  
Thickness  
50 V  
Reservedꢀforꢀfutureꢀuse  
EmbossedꢀType,ꢀ7"ꢀreel  
1.25 ±ꢀ0.15 mm  
Packaging  
B. Samsung Reliablility Test and Judgement condition  
Performance  
Test condition  
Capacitance  
Tan δ (DF)  
Withinꢀspecifiedꢀtolerance  
0.05 max.  
1.0±0.2Vrms  
1±10%  
Insulation  
RatedꢀVoltage  
60~120ꢀsec.  
10,000Mohmꢀorꢀ500Mohm㎌  
ꢀWhicheverꢀisꢀSmaller  
Noꢀabnormalꢀexteriorꢀappearance  
Noꢀdielectricꢀbreakdownꢀor  
mechanicalꢀbreakdown  
Y5V  
Resistance  
Appearance  
Withstanding  
Voltage  
Microscopeꢀ(×10)  
250%  
ofꢀtheꢀratedꢀvoltage  
Temperature  
Characterisitcs  
Adhesive Strength  
of Termination  
Bending Strength  
(Fromꢀꢁ30ꢀtoꢀ85,ꢀCapacitanceꢀchangeꢀshoudꢀbeꢀwithinꢀꢁ82~+22%)  
Noꢀpeelingꢀshallꢀbeꢀoccurꢀonꢀthe  
terminalꢀelectrode  
500gF,ꢀforꢀ10±1ꢀsec.  
Capacitanceꢀchangeꢀ:  
within ±30%  
Bendingꢀtoꢀtheꢀlimitꢀ(1mm)  
ꢀwithꢀ1.0mm/sec.  
Solderability  
Moreꢀthanꢀ75%ꢀofꢀterminalꢀsurface  
isꢀtoꢀbeꢀsolderedꢀnewly  
SnAg3.0Cu0.5ꢀsolder  
245±5,ꢀ3±0.3sec.  
(preheatingꢀ:ꢀ80~120ꢀforꢀ10~30sec.)  
Resistance to  
Soldering heat  
Capacitanceꢀchangeꢀ:ꢀ within ±20%  
Solderꢀpotꢀ:ꢀ270±5,ꢀ10±1sec.  
Tanꢀδ,ꢀIRꢀ:ꢀinitialꢀspec.  

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