CL-SB
SLIDE SWITCHES
■
STANDARD SPECIFICATIONS
■ ELECTRICAL CHARACTERISTICS
Operating temperature range
Storage temperature range
Sealing
Contact rating
Non-switching
Switching
Minimum
ꢀꢀꢀꢀ
−40 ~ 85 °C
DC50 V 200 mA
DC12 V 200 mA
DC20 mV 1 μA (Gold contacts)
DC5 V 10 mA (Silver contacts)
Non Washable
0.21 g (CL-SB-12Œ-0Œ) 0.21 g (CL-SB-12Œ-1Œ)
0.22 g (CL-SB-22Œ-0Œ) 0.22 g (CL-SB-22Œ-1Œ)
0.26 g (CL-SB-13Œ-0Œ) 0.26 g (CL-SB-13Œ-1Œ)
0.28 g (CL-SB-23Œ-0Œ) 0.28 g (CL-SB-23Œ-1Œ)
Contact timing
Non-shorting
Net weight
70mΩ maximum
1.5 mA 1 kHz
20 mV maximum
(Gold contacts)
Contact resistance
50mΩ maximum
(Silver contacts)
■
MECHANICAL CHARACTERISTICS
Insulation resistance
Dielectric strength
100 MΩ minimum (DC500 V)
No. of positions
2, 3
AC500 V, 60 s
Stroke
2 mm
2 Contacts
(CL-SB-Œ2Œ-ŒŒ)
ꢀꢀA ŵ BýýýýýýýꢀŢ1
1.5 ± 1.0ꢀN {0.153 ± 0.102kgf}
■
ENVIRONMENTAL CHARACTERISTICS
Operation force
A → B / C → BýýýýꢀꢀŢ2
1.5 ± 1.0ꢀN {0.153 ± 0.102kgf}
B → A / B → C
3 Contacts
(CL-SB-Œ3Œ-ŒŒ)
Amplitude 1.5 mm or
Acceleration 98 m/s2,
2.5 ± 1.5ꢀN {0.255 ± 0.153kgf}
Vibration
10-500-10 Hz, 3 directions for 2 h each
Stop strength
Solderability
20 N {2.04 kgf} 15 s
490 m/s2, 11 ms
6 directions for 3 times each
Shock
245 ± 3 °C, 2 ~ 3 s
10000 cycles
DC12 ± 0.5V, 200 ± 10mA
Load life
Flow : 260 ± ±3 °C, 5 ~ 6 s
40 °C, Relative humidity 90 ~ 95 %,
240 h
Humidity
Reflow:255 °C (Peak temperature)
(Please refer to the profile below)
Soldering heat
High temperature exposure
Low temperature exposure
Thermal shock
85 °C, 96 h
−40 °C, 96 h
Manual soldering:380 ± 10 °C, 3 ~ 4 s
5 N {0.51 kgf} 10 s
Shear
−40 (0.5 h) ~ 85 °C ( 0.5 h ), 5 cycles
Substrate bending
Pull-off strength
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf} 10s
〈Reflow profile for soldering heat evaluation〉
{ } : Reference only
(C)
250
Peak : 250 +5
C
0
Over 230 C
※2
※2
※1
※1
A
B C
A
B
200
150
Pre Heating Zone
180 C
150 C
90 30 s
30 10 s
100
50
Soldering Zone
Heating time
Reflow : two times maximum