Datasheet > CHF15KE130A

CHF15KE130A

更新时间： 2022-12-12 08:45:40

品牌	Logo	应用领域
美高森美 - MICROSEMI		/
页数	文件大小	规格书
3页	265K
描述
Patented Flip Chip Series

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中文翻译

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数据手册

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CHF15KE130A 数据手册

8700 E. Thomas Road

Scottsdale, AZ 85251

PH: (480) 941-6300

FAX: (480) 947-1503

FLIP CHIP TVS DIODES

CHF1.5KE6.8

thru

CHF1.5KE400CA

Patented Flip Chip Series

FEATURES

MAXIMUM RATINGS MECHANICAL

Unidirectional and Bidirectional

Max Junction Temperature: 175⁰C

Fully glass passivated

1500 watt (10/1000 ms)

Eliminates wire bonding

No overshoot

Storage Temperature: -55⁰C to +175⁰C

Flip Chip Peak Pulse Power: 1500 Watts (10/1000 ms)

Maximum non-repetitive peak power 1500 Watts

(10/1000 ms)

NON Inductive Insertion

Total continuous power dissipation @ T_lead= 75⁰C 2.5 W

Turn-on time (theoretical) unidirectional 1X10^-12

Turn-on time (theoretical) bidirectional 1X10^-9

MECHANICAL

Weight: 0.3 grams (approximate)

Cathode mark on top side

Metallization Cr - Ag – Au (Both Sides)

PACKAGING

Waffle package

50 pieces per pack (STANDARD)

BIDIRECTIONAL ALL DIMENSIONS NOMINAL

FLIP CHIP DIMENSIONS PAD SIZE & CIRCUIT

MSC0996.PDF

ISO 9001 CERTIFIED

REV F 7/20/00

12 3

中文翻译

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