Datasheet > CGH60030D-GP4

CGH60030D-GP4

更新时间： 2024-03-03 10:08:24

品牌	Logo	应用领域
MACOM		/
页数	文件大小	规格书
9页	703K
描述
30 W; 6.0 GHz; GaN HEMT Die

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CGH60030D-GP4 数据手册

CGH60030D

DIE Dimensions (units in microns)

Overall die size 1660 x 920 (+0/-50) microns, die thickness 100 (+/- 10) microns.

All Gate and Drain pads must be wire bonded for electrical connection.

Assembly Notes:

•

Recommended solder is AuSn (80/20) solder. Refer to the website for the Eutectic Die Bond

Procedure application note

•

Vacuum collet is the preferred method of pick-up.

The backside of the die is the Source (ground) contact.

Die back side gold plating is 5 microns thick minimum.

Thermosonic ball or wedge bonding are the preferred connection methods.

Gold wire must be used for connections.

Use the die label (XX-YY) for correct orientation.

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

Rev. 4.2, 2022-12-1

For further information and support please visit:

https://www.macom.com/support

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