Datasheet > CGA5L3X7R1H225M160AB_17

CGA5L3X7R1H225M160AB_17

更新时间： 2024-11-20 01:16:35

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
3页	237K
描述
Multilayer Ceramic Chip Capacitors

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CGA5L3X7R1H225M160AB_17 数据手册

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Creation Date : July 03, 2017 (GMT)

Multilayer Ceramic Chip Capacitors

CGA5L3X7R1H225M160AB

TDK item description CGA5L3X7R1H225MT****

Applications

Feature

Automotive Grade

General General (Up to 50V)

AEC-Q200 AEC-Q200

Series

Status

CGA5(3216) [EIA 1206]

Production

Size

3.20mm +0.30,-0.10mm

Length(L)

Width(W)

1.60mm +0.30,-0.10mm

0.20mm Min.

Thickness(T)

Terminal Width(B)

Terminal Spacing(G)

1.00mm Min.

2.10mm to 2.50mm(Flow Soldering)

2.00mm to 2.40mm(Reﬂow Soldering)

Recommended Land Pattern (PA)

Recommended Land Pattern (PB)

Recommended Land Pattern (PC)

1.10mm to 1.30mm(Flow Soldering)

1.00mm to 1.20mm(Reﬂow Soldering)

1.00mm to 1.30mm(Flow Soldering)

1.10mm to 1.60mm(Reﬂow Soldering)

Electrical Characteristics

Capacitance

2.2μF ±20%

50VDC

Rated Voltage

Temperature Characteristic

Dissipation Factor (Max.)

Insulation Resistance (Min.)

X7R(±15%)

227MΩ

Other

Wave (Flow)

Reﬂow

Soldering Method

AEC-Q200

Yes

Packing

Blister (Plastic)Taping [180mm Reel]

2000pcs

Package Quantity

! Images are for reference only and show exemplary products.

! This PDF document was created based on the data listed on the TDK Corporation website.

! All speciﬁcations are subject to change without notice.

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