Datasheet > CF5075AM-4

CF5075AM-4

更新时间： 2022-12-28 02:09:43

品牌	Logo	应用领域
NPC		石英晶振压控振荡器
页数	文件大小	规格书
14页	303K
描述
VCXO Module IC with Built-in Varicap

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数据手册

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CF5075AM-4 数据手册

5075 series

PAD LAYOUT

(Unit: µm)

^ꢀ5075A× (for Flip Chip Bonding)

^ꢀ5075B× (for Wire Bonding)

(420, 345)

VSS

VDD

(0,0)

(−420, −345)

XTN

Chip size: 0.84 × 0.69mm

Chip thickness: 130µm 15µm

Chip size: 0.84 × 0.69mm

Chip thickness: 130µm 15µm

PAD size: 90µm × 90µm

Chip base: V level

PAD size: 90µm × 90µm

Chip base: V level

PAD DIMENSIONS PIN DESCRIPTION

Pad dimensions [µm]

Pad No.

I/O

Description

5075A× 5075B×

–189

189

315

–315

–240

–21

225

XTN

VDD

Crystal connection pin (ampliﬁer input)

–

Crystal connection pin (ampliﬁer output)

(+) supply pin

–

Clock output pin

VSS

(−) supply pin

Oscillation frequency control voltage input pin (positive polarity)

(frequency increases with increasing voltage)

–315

–21

BLOCK DIAGRAM

Voltage

Regulator

VDD

CIN

Oscillation

Detector

COUT

Level Shifter

XTN

RVC2

CMOS ouput

Buffer

N^*1

RVC1

CVC1

CVC2

VSS

*1. N = 1, 2, 4, 8, 16

SEIKO NPC CORPORATION —3

1 234 5 6 7...14

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