SSMMDD SSwwiittcchinngg Diode
(Lead-free Device)
CDSU400
CCOOMMCCHHIIPP
www.comchip.com.tw
High Speed
Features
Designed for mounting on small surface.
Extremely thin/leadless package.
Low leakage current.
0603(1608)
0.071(1.80)
0.063(1.60)
0.039(1.00)
0.031(0.80)
High mounting capability, strong surge
withstand, high reliability.
Mechanical data
0.033 (0.85)
0.027 (0.70)
Case: 0603 (1608) standard package,
molded plastic.
0.010(0.25) Typ.
Terminals: Gold plated, solderable per
MIL-STD-750, method 2026.
0.012 (0.30) Typ.
Polarity: Indicated by cathode band.
0.014(0.35) Typ.
Mounting position: Any.
Dimensions in inches and (millimeter)
Weight: 0.003 gram (approximately)
Maximum Rating ( at TA = 25 C unless otherwise noted )
Parameter
Conditions
Typ Max Unit
Symbol Min
Repetitive peak reverse voltage
Reverse voltage
90
80
V
VRRM
V
VR
Average forward current
100
mA
IO
8.3 ms singlehalf sine-wave superimposed
on rate load( JEDEC method)
Forward current , surge peak
1000
mA
IFSM
Power Dissipation
150
+125
+125
mW
C
PD
Storage temperature
Junction temperature
TSTG
-40
C
T j
-40
Electrical Characteristics ( at TA = 25 C unless otherwise noted )
Parameter
Conditions
Symbol Min Typ Max
Unit
Forward voltage
I F = 100 mADC
VF
1.0
V
Reverse current
VR = 80 V
IR
0.1
uA
Capacitance between terminals
Reverse recovery time
f = 1MHz, and 0.5VDC reversevoltage
CT
3
4
pF
VR = 6V, IF = 10 mA, RL =50 ohms
Trr
nS
RDS0301001-B