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CDR01BX471BKYR PDF预览

CDR01BX471BKYR

更新时间: 2024-02-18 14:21:49
品牌 Logo 应用领域
基美 - KEMET 电容器
页数 文件大小 规格书
10页 1143K
描述
Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, BX, 15% TC, 0.00047uF, Surface Mount, 0805, CHIP

CDR01BX471BKYR 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active包装说明:CHIP
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8532.24.00.20Factory Lead Time:11 weeks
风险等级:5.34电容:0.00047 µF
电容器类型:CERAMIC CAPACITOR介电材料:CERAMIC
高度:0.98 mmJESD-609代码:e3
长度:2.03 mm安装特点:SURFACE MOUNT
多层:Yes负容差:10%
端子数量:2最高工作温度:125 °C
最低工作温度:-55 °C封装形状:RECTANGULAR PACKAGE
封装形式:SMT包装方法:TR, 7 INCH
正容差:10%额定(直流)电压(URdc):100 V
参考标准:MIL-PRF-55681系列:C(SIZE)P
尺寸代码:0805表面贴装:YES
温度特性代码:BX温度系数:15% ppm/ °C
端子面层:Tin (Sn) - with Nickel (Ni) barrier端子形状:WRAPAROUND
宽度:1.27 mm

CDR01BX471BKYR 数据手册

 浏览型号CDR01BX471BKYR的Datasheet PDF文件第4页浏览型号CDR01BX471BKYR的Datasheet PDF文件第5页浏览型号CDR01BX471BKYR的Datasheet PDF文件第6页浏览型号CDR01BX471BKYR的Datasheet PDF文件第7页浏览型号CDR01BX471BKYR的Datasheet PDF文件第8页浏览型号CDR01BX471BKYR的Datasheet PDF文件第10页 
CERAMIC CHIP CAPACITORS  
Packaging Information  
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):  
10 pitches cumulative  
P0  
tolerance on tape  
± 0.2 (± 0.008)  
T
D0  
P2  
E
Top  
Tape  
Cover  
A0  
Bottom  
Tape  
Cover  
F
W
B0  
G2  
T1  
P1  
Center lines  
of cavity  
Max. Cavity Size  
See Note 1  
Table 1  
User Direction of Feed  
Table 1: 8 & 12mm PunchedTape  
(Metric Dimensions Will Govern)  
Constant Dimensions - Millimeters (Inches)  
Tape  
Size  
D
P
P
T
G
G
2
E
R Min.  
0
0
2
1
1
8mm  
and  
12mm  
1.5  
1.75 ± 0.10  
4.0 ± 0.10  
2.0 ± 0.05  
0.10 0.75 0.75 25 (.984)  
(.004) (.030) (.030) See Note 2  
+0.10, -0.0  
(.059  
(.069 ± 0.004) (.157 ± 0.004) (.079 ± 0.002) Max. Min. Min.  
Table 1  
+0.004, -0.0)  
Table 1: 8 & 12mm PunchedTape  
(Metric Dimensions Will Govern)  
Variable Dimensions - Millimeters (Inches)  
Tape  
Size  
P
W
A B  
0 0  
T
F
1
8mm  
1/2  
2.0 ± 0.10  
1.1mm (.043)  
Max. for Paper  
Base Tape and  
1.6mm (.063)  
Max. for Non-  
Paper Base  
(.079 ± .004)  
3.5 ± 0.05  
8.0 ± ±0.3  
See Note 1  
Table 1  
Pitch See Require-  
ments  
(.138 ± .002)  
(.315 ± ±0.012)  
Section 3.3 (d)  
8mm  
4.0 ± 0.10  
(0.157 ± .004)  
Compositions.  
See Note 3.  
12mm  
12mm  
4.0 ± 0.10  
5.5 ± 0.05  
12.0 ± 0.3  
(0.157 ± .004)  
8.0 ± 0.10  
(.217 ± .002)  
(.472 ± .012)  
Double (0.315 ± .004)  
Pitch  
Note:  
1. A , B and T determined by the maximum dimensions to the ends of the terminals extending from the  
0
0
body and/or the body dimensions of the component. The clearance between the ends of the terminals or  
body of the component to the sides and depth of the cavity (A , B and T) must be within 0.05mm (.002)  
0
0
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component  
within the cavity of not more than 20 degrees (see sketches A and B).  
2. Tape with components shall pass around radius "R" without damage.  
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.  
Sketch C:  
Component Rotation - Top View  
Maximum  
Sketch B:  
R
(Min.)  
Max. Component  
Rotation - Front  
component rotation.  
Sketch A:  
Bending Radius  
See Note 2  
Table 1  
20°  
Cross Sectional View  
Typical  
component  
center line  
20°  
96  
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  

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