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CD4056BME4 PDF预览

CD4056BME4

更新时间： 2024-01-25 22:28:50
品牌 Logo 应用领域
德州仪器 - TI 显示驱动器
页数 文件大小 规格书
18页 1002K
描述
CMOS Lquid-Crystal Display Drivers

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CD4056BME4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：SOP, SOP16,.25针数：16
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.06
数据输入模式：PARALLEL显示模式：SEGMENT
输入特性：STANDARD接口集成电路类型：LIQUID CRYSTAL DISPLAY DRIVER
JESD-30 代码：R-PDSO-G16JESD-609代码：e4
长度：9.9 mm湿度敏感等级：1
复用显示功能：NO底板数：0-BP
位数：7位数/字符：1-DIGIT
功能数量：1区段数：7
端子数量：16最高工作温度：125 °C
最低工作温度：-55 °C封装主体材料：PLASTIC/EPOXY
封装代码：SOP封装等效代码：SOP16,.25
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：260电源：5/15 V
认证状态：Not Qualified座面最大高度：1.75 mm
子类别：Other Interface ICs最大压摆率：3 mA
最大供电电压：18 V最小供电电压：3 V
标称供电电压：5 V表面贴装：YES
技术：CMOS温度等级：MILITARY
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：3.9 mm
Base Number Matches：1

CD4056BME4 数据手册

 浏览型号CD4056BME4的Datasheet PDF文件第5页浏览型号CD4056BME4的Datasheet PDF文件第6页浏览型号CD4056BME4的Datasheet PDF文件第7页浏览型号CD4056BME4的Datasheet PDF文件第9页浏览型号CD4056BME4的Datasheet PDF文件第10页浏览型号CD4056BME4的Datasheet PDF文件第11页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Aug-2010  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
CD4056BMT  
CD4056BMTE4  
CD4056BMTG4  
CD4056BPW  
SOIC  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
250  
250  
250  
90  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
Purchase Samples  
D
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
Purchase Samples  
Purchase Samples  
Purchase Samples  
Purchase Samples  
Purchase Samples  
Purchase Samples  
Purchase Samples  
Purchase Samples  
SOIC  
D
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
PW  
PW  
Green (RoHS  
& no Sb/Br)  
CD4056BPWE4  
CD4056BPWG4  
CD4056BPWR  
CD4056BPWRE4  
CD4056BPWRG4  
90  
Green (RoHS  
& no Sb/Br)  
90  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Addendum-Page 3  
1...567891011...18

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