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001-05 / 20060110 / ef31_ccr.fm
CCR Series
Piezoelectronic Products
Ceramic Resonators
SMD
TYPICAL ELECTRICAL CHARACTERISTICS
OSCILLATING FREQUENCY DRIFT OVER TEMPERATURE
MUC8/MXC8: 0.3%/–40 to +85°C(Standard)
CCR8.0MXC8
OSCILLATING FREQUENCY AGING
MUC8/MXC8: 0.3%/10years(Standard)
CCR8.0MXC8
0.5
0.4
0.5
0.4
0.3
0.3
0.2
0.2
0.1
0.1
0
0
–0.1
–0.2
–0.3
–0.4
–0.5
–0.1
–0.2
–0.3
–0.4
–0.5
1
10
100
1000
10000 100000
–50
–25
0
25
50
75
100
(
)
(
)
Time hrs
Temperature ˚C
MXC7: 0.2%/–40 to +85°C(Standard)
CCR48.0MXC7
MXC7: 0.1%/10years(Standard)
CCR48.0MXC7
0.20
0.15
0.10
0.05
0.00
0.10
0.08
0.06
0.04
0.02
0.00
–0.02
–0.04
–0.06
–0.08
–0.10
–0.05
–0.10
–0.15
–0.20
–50 –30 –10 0 10
30
(
50
70
90
0.1
1
10
)
Time hrs
100
1000
10000
)
(
Temperature ˚C
RECOMMENDED SOLDERING CONDITIONS
REFLOW SOLDERING
RELIABILITY AND TEST CONDITIONS
The following test items are satisfied.
(1) Oscillating frequency change: Within 0.25%
(2) Resonant resistance change: Within 10Ω
(3) Appearance; serious abnormalities not to exist.
10s max.
( )
2
Test items
Test conditions
Temperature: –40 3°C
Time: 1000h
200˚C
Low temperature storage
Temperature: +85 2°C
Time: 1000h
Humidity: 90 to 95(%)RH
Temperature: 60 2°C
( )
1
High temperature storage
Loading humidity resistance
60s max.
Preheating: 60s min.
Time: 1000h
Thermal shock
–40°C (30min), 85°C (30min) x 100 cycles
Solder temperature: peak 260°C, 10s
reflow
( )
Time s
Soldering heat resistance
Drop 3 times onto the concrete from a
height of 1m
Drop
Frequency: 10 ⇔ 55 ⇔ 10Hz/min
Vibration
Amplitude: 1.5mm
X, Y and Z directions for 2h each
Solder this product onto a glass epoxy
board (L100×W40×T1.6mm), press it by up
to 1mm in 1mm/s and keep it for 5sec.
Board bend test
• All specifications are subject to change without notice.