MULTILAVER CHIP FERRITE BEADS
焊槽法;无铅焊锡;
温度(245±5) ℃;
浸渍时间(3±0.3) s。
无可见损伤;
可焊性
电极面95%以上覆盖新的焊料。
8
Solder ability
95% or more of electrode area Solder bath; Lead-free solder;
shall be coated by new solder.
Temperature (245±5) ℃;
Immersion timer (3±0.3) seconds.
电感器安装在厚1.6mm环氧玻璃布板上,以1mm/s的速度向
下弯曲2mm;
无可见损伤;
维持时间60s±5s。
弯曲
阻抗:△Z/Z≤±30%。
No Visible damage;
Impedance:△Z/Z ≤ ±30%
9
The testing samples shall be mounted on a 100mm×40mm
FR4 PCB board,which is 1.6mm±0.2mm thick。
Bending shall be applied to the 2.0mm with 1.0mm/sec;
Duration:60±5s。
Board flex
试样安装在环氧玻璃布板上,施加1005规格:5N,≥1608规
格:17.7N的力到试样的侧面,保持60s±1s。
The testing samples shall be mounted on the testing epoxy
boards,exerting force on side of the samples, Size 1005:
5N ; ≥ Size 1608:17.7N,
Duration 60s±1s。
无可见损伤;
端子强度
Terminal Strength
(SMD)
阻抗:△Z/Z ≤±30%。
No Visible damage;
Impedance:△Z/Z ≤ ±30%
10
◆产品特性曲线图
Product Characteristic Curve
CBE252010 Type
CBE252011A301T
CBE252010A601T
1000
900
800
700
600
500
400
300
200
100
0
1400
1200
1000
800
600
400
200
0
Z
R
X
Z
R
X
1
10
100
1000
10000
1
10
100
1000
10000
Frequency(MHz)
Frequency(MHz)
CBE322515 Type
4