Datasheet > CAY16-36R5F4LF

CAY16-36R5F4LF

更新时间： 2022-09-29 19:40:26

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
5页	458K
描述
RES ARRAY 4 RES 36.5 OHM 1206

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CAY16-36R5F4LF 数据手册

Chip Resistor Arrays - Application Note

Component Placement

a. Reduce the mechanical stress to a minimum during and after placing of the unit in order not to damage the terminals and

protective coating.

b. Misplacement of components may cause solder bridges.

Soldering

a. Reﬂow soldering: Recommendation is shown in the following chart.

b. Wave soldering: Recommendation according to IEC standards.

c. Hand soldering: Don’t touch the protective coating of the part. Solder within 3 seconds when the temperature is over 280 ºC.

Soldering

Preheating

Gradual Cooling

250

200

150

100

10-30 sec.

60 sec. min.

120 sec. min.

Speciﬁcationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.

Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspeciﬁcꢀapplications.ꢀ

Theꢀproductsꢀdescribedꢀhereinꢀandꢀthisꢀdocumentꢀareꢀsubjectꢀtoꢀspeciﬁcꢀlegalꢀdisclaimersꢀasꢀsetꢀforthꢀonꢀtheꢀlastꢀpageꢀofꢀthisꢀdocument,ꢀandꢀatꢀwww.bourns.com/docs/legal/disclaimer.pdf.

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