Datasheet > CAT3200ES6-5-TE7

CAT3200ES6-5-TE7

更新时间： 2024-02-08 03:21:14

品牌	Logo	应用领域
CATALYST		转换器泵
页数	文件大小	规格书
12页	149K
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Low Noise Regulated Charge Pump DC-DC Converter

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CAT3200ES6-5-TE7 技术参数

是否Rohs认证：	不符合	生命周期：	Transferred
零件包装代码：	SOT-23	包装说明：	VSSOP, TSOP6,.11,37
针数：	6	Reach Compliance Code：	unknown
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
风险等级：	5.12	模拟集成电路 - 其他类型：	SWITCHED CAPACITOR REGULATOR
控制模式：	VOLTAGE-MODE	最大输入电压：	4.5 V
最小输入电压：	2.7 V	标称输入电压：	3.6 V
JESD-30 代码：	R-PDSO-G6	JESD-609代码：	e0
长度：	2.9 mm	湿度敏感等级：	1
功能数量：	1	端子数量：	6
最高工作温度：	85 °C	最低工作温度：	-40 °C
最大输出电流：	0.2 A	标称输出电压：	5 V
封装主体材料：	PLASTIC/EPOXY	封装代码：	VSSOP
封装等效代码：	TSOP6,.11,37	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	峰值回流温度（摄氏度）：	240
认证状态：	Not Qualified	座面最大高度：	1 mm
子类别：	Other Analog ICs	表面贴装：	YES
切换器配置：	DOUBLER INVERTER	最大切换频率：	2600 kHz
温度等级：	INDUSTRIAL	端子面层：	TIN LEAD
端子形式：	GULL WING	端子节距：	0.95 mm
端子位置：	DUAL	处于峰值回流温度下的最长时间：	30
宽度：	1.6 mm	Base Number Matches：	1

CAT3200ES6-5-TE7 数据手册

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CAT3200/3200-5

APPLICATION INFORMATION

Ceramic Capacitors

Ceramic capacitors of different dielectric materials lose

theircapacitancewithhighertemperatureandvoltageat

different rates. For example, a capacitor made of X5R or

X7R material will retain most of its capacitance from –

40°C to 85°C whereas a Z5U or Y5V style capacitor will

lose considerable capacitance over that range.

The overall junction to ambient thermal resistance (θ_JA)

for device power dissipation (P_D) consists primarily of

two paths in series. The first path is the junction to the

case (θ_JC) which is defined by the package style, and the

second path is case to ambient (θ_CA) thermal resistance

which is dependent on board layout. The final operating

junction temperature for any set of conditions can be

estimated by the following thermal equation:

T_JUNC= T_AMB+ P (Θ_JC) + P (Θ_CA)

Z5UandY5Vcapacitorsmayalsohavevoltagecoefficient

causing them to lose 60% or more of their capacitance

when the rated voltage is applied. When comparing

differentcapacitorsitisoftenusefulconsidertheamount

of achievable capacitance for a given case size rather

than discussing the specified capacitance value. For

example,overratedvoltageandtemperatureconditions,

a 1µF, 10V, Y5V ceramic capacitor in an 0603 case may

not provide any more capacitance than a 0.22µF, 10V,

X7R available in the same 0603 case. For many

CAT3200/CAT3200-5applicationsthesecapacitorscan

be considered roughly equivalent.

= T_AMB+ P (Θ_JA)

The CAT3200 in SOT23 package, when mounted on

printed circuit board with two square inches of copper

allocated for “heat spreading”, will result with an overall

θ_JAof less than 150°C/W.

For a typical application operating from a 3.8V input

supply, the maximum power dissipation is 260mW

(100mA x 3V). This would result if a maximum junction

temperature of :

The capacitor manufacturer’s data sheet should be

consultedtodeterminewhatvalueofcapacitorisneeded

to ensure the desired capacitance at all temperatures

and voltages. Below is a list of ceramic capacitor

manufacturers and how to contact them:

JUNC = TAMB + P (θJA)

= 85°C + 0.26W (150°C/W)

= 85°C + 39°C = 124°C

The use of multi-layer board construction with power

planes will further enhance the overall thermal

performance. In the event of no dedicated copper area

being used for heat spreading, a multi-layer board will

typically provide the CAT3200 with an overall θ_JAof

200°C/W. This level of thermal conduction would allow

up to 200mW be safely dissipated within the device.

Capacitor

Manufacturer Web

Phone

Murata

www.murata.com

814.237.1431

843.448.9411

AVX/Kemet

Vishay

www.avxcorp.com

www.vishay.com

www.kemet.com

Kemet

408.986.0424

408.573.4150

Taiyo Yuden www.t-yuden.com

Thermal Management

For higher input voltages and maximum output current

there can be substantial power dissipation in the

CAT3200/CAT3200-5. If the junction temperature

increases to 160°C, the thermal shutdown circuitry will

automatically turn off the output.

A good thermal connection to the PC board is

recommended to reduce the chip temperature.

ConnectingtheGNDpin(Pins4/5forCAT3200,Pin2for

CAT3200-5) to a ground plane, and maintaining a solid

ground plane under the device reduces the overall

thermal resistance.

Doc. No. 5002, Rev. E

1...5 6 789 10 11 12

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