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CAT16-103J4 PDF预览

CAT16-103J4

更新时间: 2024-01-11 20:48:40
品牌 Logo 应用领域
伯恩斯 - BOURNS /
页数 文件大小 规格书
4页 316K
描述
Chip Resistor Arrays

CAT16-103J4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMT, 0612
Reach Compliance Code:compliantFactory Lead Time:14 weeks
风险等级:1.55构造:Chip
元件功耗:0.062 W第一元件电阻:10000 Ω
JESD-609代码:e3安装特点:SURFACE MOUNT
网络类型:ISOLATED元件数量:1
功能数量:4端子数量:8
最高工作温度:125 °C最低工作温度:-55 °C
封装高度:0.5 mm封装长度:3.2 mm
封装形状:RECTANGULAR PACKAGE封装形式:SMT
封装宽度:1.55 mm包装方法:TR, PAPER, 7 INCH
额定功率耗散 (P):0.062 W额定温度:70 °C
电阻:10000 Ω电阻器类型:ARRAY/NETWORK RESISTOR
尺寸代码:0612子类别:ARRAY/NETWORK RESISTOR
表面贴装:YES温度系数:200 ppm/ °C
端子面层:Tin (Sn) - with Nickel (Ni) barrier端子形状:WRAPAROUND
容差:5%工作电压:50 V
Base Number Matches:1

CAT16-103J4 数据手册

 浏览型号CAT16-103J4的Datasheet PDF文件第1页浏览型号CAT16-103J4的Datasheet PDF文件第2页浏览型号CAT16-103J4的Datasheet PDF文件第3页 
Chip Resistor Arrays - Application Note  
Component Placement  
a. Reduce the mechanical stress to a minimum during and a%ter placing o% the unit in order not to damage the terminals and  
protective coating.  
b. Misplacement o% components may cause solder bridges.  
Soldering  
a. Re%low soldering: Recommendation is shown in the %ollowing chart.  
b. Wave soldering: Recommendation according to IEꢂ standards.  
c. Hand soldering: Don’t touch the protective coating o% the part. Solder within 3 seconds when the temperature is over (80 ºꢂ.  
Soldering  
Preheating  
Gradual Cooling  
250  
200  
150  
100  
50  
0
10-30 sec.  
60 sec. min.  
120 sec. min.  
Cleaning  
ꢃ recommended cleaning method is shown in the %ollowing table.  
Cleaning Condition  
Solvents  
Dipping  
Ultrasonic Wave Washing  
± minute maximum  
Power: (0 W/L  
Isopropyl alcohol  
5 minutes maximum  
Frequency: ±0 to ±00 kHz  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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