Datasheet > C4GADUC4330AA0K

C4GADUC4330AA0K

更新时间： 2022-12-29 21:39:26

品牌	Logo	应用领域
基美 - KEMET		/
页数	文件大小	规格书
10页	1787K
描述
Printed Circuit Board Mount Power Film Capacitors

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C4GADUC4330AA0K 数据手册

Power and AC Film Capacitors

Printed Circuit Board Mount Power Film Capacitors – C4G Series, Axial Round, 250 – 850 VDC/160 – 450 VAC

Soldering Process

The implementation of the RoHS Directive has required the

selection SnAgCu (SAC) alloys or SnCu alloys as primary solder.

This has increased the liquidus temperature from that of 183ºC

for SnPb eutectic alloy to 217ºC – 221ºC for the new alloys. As

a result, the heat stress to components, even in wave soldering,

has increased considerably due to higher pre-heat and wave

temperatures. Polypropylene capacitors are especially sensitive

to heat (melting point of polypropylene is 160ºC – 170ºC). Wave

soldering can be destructive especially for mechanically small

polypropylene capacitors (lead spacings 5 – 10 mm) and great

care must be taken during soldering. The solder proﬁles from

KEMET are highly recommended. You may also refer to the wave

soldering curve from IEC Publication 61760 – 1 Edition 2. Please

consult KEMET with any questions.

Construction

Detailed Cross Section

Metal Contact

Layer

Single-sided Metallized

Polypropylene Film

(Second Layer)

Margin

Lead

Polyester Tape

Wrapping

Lead

Single-sided Metallized

Polypropylene Film

(First Layer)

Margin

Polyester Tape

Wrapping

Thermosetting

Resin End-Fill

Thermosetting

Resin End-Fill

Metal Contact

Layer

Winding Scheme

Single-sided

Metallized

Polypropylene

Film

1 Section

F3040_C4G_AXIAL • 4/20/2016

1...4 5 678 9 10

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