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C3216X7R1H105K160AB_17 PDF预览

C3216X7R1H105K160AB_17

更新时间: 2024-11-20 01:22:23
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 237K
描述
Multilayer Ceramic Chip Capacitors

C3216X7R1H105K160AB_17 数据手册

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Creation Date : May 29, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C3216X7R1H105K160AB  
TDK item description C3216X7R1H105KT****  
Commercial Grade  
Applications  
Please refer to Part No. CGA5L3X7R1H105K160AB for Automotive use.  
General General (Up to 50V)  
C3216 [EIA 1206]  
Production (Not Recommended for New Design)  
Feature  
Series  
Status  
Size  
3.20mm ±0.20mm  
Length(L)  
Width(W)  
1.60mm ±0.20mm  
1.60mm ±0.20mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
1.00mm Min.  
2.10mm to 2.50mm(Flow Soldering)  
2.00mm to 2.40mm(Reflow Soldering)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
1.10mm to 1.30mm(Flow Soldering)  
1.00mm to 1.20mm(Reflow Soldering)  
1.00mm to 1.30mm(Flow Soldering)  
1.10mm to 1.60mm(Reflow Soldering)  
Electrical Characteristics  
Capacitance  
1μF ±10%  
50VDC  
Rated Voltage  
Temperature Characteristic  
Dissipation Factor (Max.)  
Insulation Resistance (Min.)  
X7R(±15%)  
5%  
500MΩ  
Other  
Wave (Flow)  
Reflow  
Soldering Method  
AEC-Q200  
No  
Packing  
Blister (Plastic)Taping [180mm Reel]  
2000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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General Application