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C2-1N5S-10 PDF预览

C2-1N5S-10

更新时间: 2022-12-17 03:25:58
品牌 Logo 应用领域
SUPERWORLD 电感器
页数 文件大小 规格书
7页 378K
描述
CERAMIC CHIP INDUCTORS

C2-1N5S-10 数据手册

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CERAMIC CHIP INDUCTORS  
C2 SERIES  
8. RELIABILITY & TEST CONDITION :  
ITEM  
PERFORMANCE  
TEST CONDITION  
Preheat : 100~150°C, 60sec.  
Solder Heat Resistance  
Appearance : Cracks should not be allowed.  
More than 75% of the terminal electrode  
should be covered with new solder.  
Solder : Sn-Ag3.0-Cu0.5  
Solder Temperature : 265±3°C  
Flux : Rosin  
Preheating Dipping Natural  
cooling  
Dip Time : 6±1sec.  
265°C  
150°C  
60  
6±1  
seconds  
seconds  
Preheat : 150°C, 60sec.  
Solder : Sn-Ag3.0-Cu0.5  
Solder Temperature : 240±5°C  
Flux : Rosin  
Solderability  
More than 90% of the terminal electrode  
should be covered with new solder.  
Preheating Dipping Natural  
cooling  
Dip Time : 3±1sec.  
240°C  
150°C  
60  
seconds  
3±1.0  
seconds  
Terminal Strength  
The terminal electrode & the dielectric must  
not be damaged by the forces applied on the  
right conditions.  
For C Series :  
Size  
1
Force (Kfg)  
0.2  
Time (sec)  
2
0.5  
3
0.6  
W
4
1.0  
> 25  
5
1.0  
6
1.0  
7
1.5  
W
8
2.0  
Flexture Strength  
The terminal electrode & the dielectric must  
not be damaged by the forces applied on the  
right conditions.  
Solder a chip on a test substrate, bend the substrate  
by 3mm (0.118in) for 10secs and return.  
20(.787)  
Bending  
45(1.772) 45(1.772)  
100(3.937)  
40(1.575)  
NOTE : Specifications subject to change without notice. Please check our website for latest information.  
26.09.2008  
SUPERWORLD ELECTRONICS (S) PTE LTD  
PG. 4  

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