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C1812C124K8JAC7800 PDF预览

C1812C124K8JAC7800

更新时间: 2024-01-15 07:11:43
品牌 Logo 应用领域
基美 - KEMET 电容器
页数 文件大小 规格书
20页 1424K
描述
Capacitor, Ceramic, Chip, General Purpose, 0.12uF, 6.3V, ±10%, U2J, 1812 (4532 mm), Sn/NiBar, -55º ~ +125ºC, 7" Reel/Unmarked

C1812C124K8JAC7800 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:1812
包装说明:, 1812Reach Compliance Code:compliant
风险等级:5.69电容:0.12 µF
电容器类型:CERAMIC CAPACITOR介电材料:CERAMIC
高度:1 mm长度:4.5 mm
安装特点:SURFACE MOUNT多层:Yes
负容差:10%端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
封装形式:SMT包装方法:TR, EMBOSSED PLASTIC, 7 INCH
正容差:10%额定(直流)电压(URdc):10 V
尺寸代码:1812表面贴装:YES
温度特性代码:U2J温度系数:-750/+120ppm/Cel ppm/ °C
端子面层:Pure Matte Tin (Sn) - with Nickel (Ni) barrier端子形状:WRAPAROUND
宽度:3.2 mmBase Number Matches:1

C1812C124K8JAC7800 数据手册

 浏览型号C1812C124K8JAC7800的Datasheet PDF文件第12页浏览型号C1812C124K8JAC7800的Datasheet PDF文件第13页浏览型号C1812C124K8JAC7800的Datasheet PDF文件第14页浏览型号C1812C124K8JAC7800的Datasheet PDF文件第16页浏览型号C1812C124K8JAC7800的Datasheet PDF文件第17页浏览型号C1812C124K8JAC7800的Datasheet PDF文件第18页 
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)  
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)  
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions  
2  
2  
ꢎ10 pitches cumulative  
tolerance on tape ꢏ0ꢈ2 mmꢐ  
1  
0  
ꢉD0  
A0  
0  
2  
1  
0  
S1  
1  
1  
Cover ꢁape  
ꢊmꢇossment  
ꢂor cavity siꢋe,  
see ꢌote 1 ꢁaꢇle ꢍ  
Center Lines of Cavity  
ꢉD1  
1 is for tape feeder reference only,  
includinꢆ draft concentric aꢇout ꢄ0ꢈ  
Uꢀꢁꢂ ꢃꢄꢂꢁꢅꢆꢄꢇꢈ ꢇꢉ Uꢈꢂꢁꢁꢊꢄꢈꢋ  
Table 6 – Embossed (Plastic) Carrier Tape Dimensions  
Metric will govern  
Constant Dimensions — Millimeters (Inches)  
D1 Minimum  
Note 1  
1.0  
(0.039)  
R Reference S1 Minimum  
T
T1  
TapeꢀSize  
8 mm  
D0  
E1  
P0  
P2  
Note 2  
Note 3  
Maximum Maximum  
25.0  
(0.984)  
1.5ꢀ+0.10/−0.0ꢀ  
(0.059ꢀ+0.004/−0.0)  
1.75ꢀ±0.10ꢀ  
4.0ꢀ±0.10ꢀ  
2.0ꢀ±0.05  
0.600  
(0.024)  
0.600  
(0.024)  
0.100  
(0.004)  
12 mm  
16 mm  
(0.069ꢀ±0.004) (0.157ꢀ±0.004) (0.079ꢀ±0.002)  
1.5  
(0.059)  
30  
(1.181)  
Variable Dimensions — Millimeters (Inches)  
B1 Maximum  
Note 4  
E2  
T2  
W
TapeꢀSize  
8 mm  
Pitch  
F
P1  
A0,B0ꢀ&ꢀK0  
Minimum  
6.25  
(0.246)  
Maximum Maximum  
2.5  
(0.098)  
4.35  
(0.171)  
3.5ꢀ±0.05ꢀ  
(0.138ꢀ±0.002) (0.157ꢀ±0.004)  
4.0ꢀ±0.10  
8.3  
(0.327)  
Single (4 mm)  
Single (4 mm)  
8.2  
10.25  
5.5ꢀ±0.05ꢀ  
8.0ꢀ±0.10  
4.6  
12.3  
12 mm  
16 mm  
Note 5  
andꢀDoubleꢀ(8ꢀmm)  
(0.323)  
(0.404)  
(0.217ꢀ±0.002) (0.315ꢀ±0.004)  
(0.181)  
(0.484)  
12.1  
(0.476)  
14.25  
(0.561)  
7.5ꢀ±0.05 12.0ꢀ±0.10  
(0.138ꢀ±0.002)ꢀ (0.157ꢀ±0.004)ꢀ  
4.6  
(0.181)  
16.3  
(0.642)  
Triple (12 mm)  
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment  
location and the hole location shall be applied independently of each other.  
2. The tape with or without components shall pass around R without damage (see Figure 6.)  
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)  
4. B1 dimension is a reference dimension for tape feeder clearance only.  
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:  
(a) the component does not protrude above the top surface of the carrier tape.  
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been  
removed.  
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)  
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape  
(see Figure 4.)  
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.  
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.  
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com  
C1086_U2J • 2/28/2018  
15  

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