Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
ꢁ
ꢁ2
ꢀ2
ꢎ10 pitches cumulative
tolerance on tape ꢏ0ꢈ2 mmꢐ
ꢊ1
ꢀ0
ꢉD0
A0
ꢂ
ꢅ0
ꢃ
ꢊ2
ꢄ1
ꢄ0
S1
ꢀ1
ꢁ1
Cover ꢁape
ꢊmꢇossment
ꢂor cavity siꢋe,
see ꢌote 1 ꢁaꢇle ꢍ
Center Lines of Cavity
ꢉD1
ꢄ1 is for tape feeder reference only,
includinꢆ draft concentric aꢇout ꢄ0ꢈ
Uꢀꢁꢂ ꢃꢄꢂꢁꢅꢆꢄꢇꢈ ꢇꢉ Uꢈꢂꢁꢁꢊꢄꢈꢋ
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
TapeꢀSize
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum Maximum
25.0
(0.984)
1.5ꢀ+0.10/−0.0ꢀ
(0.059ꢀ+0.004/−0.0)
1.75ꢀ±0.10ꢀ
4.0ꢀ±0.10ꢀ
2.0ꢀ±0.05
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069ꢀ±0.004) (0.157ꢀ±0.004) (0.079ꢀ±0.002)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
Note 4
E2
T2
W
TapeꢀSize
8 mm
Pitch
F
P1
A0,B0ꢀ&ꢀK0
Minimum
6.25
(0.246)
Maximum Maximum
2.5
(0.098)
4.35
(0.171)
3.5ꢀ±0.05ꢀ
(0.138ꢀ±0.002) (0.157ꢀ±0.004)
4.0ꢀ±0.10
8.3
(0.327)
Single (4 mm)
Single (4 mm)
8.2
10.25
5.5ꢀ±0.05ꢀ
8.0ꢀ±0.10
4.6
12.3
12 mm
16 mm
Note 5
andꢀDoubleꢀ(8ꢀmm)
(0.323)
(0.404)
(0.217ꢀ±0.002) (0.315ꢀ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5ꢀ±0.05 12.0ꢀ±0.10
(0.138ꢀ±0.002)ꢀ (0.157ꢀ±0.004)ꢀ
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
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