CERAMIC CHIP CAPACITORS
FEATURES
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: 0.10 pFꢁ 0.25
pFꢁ 0.5 pFꢁ 1ꢀꢁ 2ꢀꢁ 5ꢀꢁ 10ꢀꢁ 20ꢀꢁ and
+80ꢀ-20ꢀ
• RoHS Compliant
CAPACITOR OUTLINE DRAWINGS
TIN PLATE
L
W
B
T
NICKEL PLATE
S
CONDUCTIVE
METALLIZATION
ELECTRODES
DIMENSIONS—MILLIMETERS AND (INCHES)
S
EIA SIZE
CODE
METRIC
SIZE CODE
T
MOUNTING
TECHNIQUE
L - LENGTH
W - WIDTH
B - BANDWIDTH
SEPARATION
minimum
THICKNESS
0201*
0402*
0603
0805*
1206*
1210*
1808
1812
1825*
2220
2225
0603
1005
1608
2012
3216
3225
4520
4532
4564
5650
5664
0.6 (.024) ± .03 (.001)
1.0 (.04) ± .05 (.002)
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
5.6 (.220) ± .40 (.016)
5.6 (.220) ± .40 (.016)
0.3 ± (.012) ± .03 (.001)
0.5 (.02) ± .05 (.002)
0.8 (.032) ± .15 (.006)
1.25 (.049) ± .20 (.008)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .30 (.012)
6.4 (.252) ± .40 (.016)
5.0 (.197) ± .40 (.016)
6.3 (.248) ± .40 (.016)
0.15 (.006) ± .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) ± .15 (.006)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
Solder Reflow
Solder Wave +
or
Solder Reflow
See page 78
for thickness
dimensions.
N/A
N/A
N/A
Solder Reflow
N/A
N/A
N/A
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
(Standard Chips - For
Military see page 87)
CAPACITOR ORDERING INFORMATION
C 0805 C 103 K 5 R A C*
CERAMIC
END METALLIZATION
SIZE CODE
C-Standard (Tin-plated nickel barrier)
SPECIFICATION
C - Standard
FAILURE RATE LEVEL
CAPACITANCE CODE
A- Not Applicable
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – 0.10pF J – 5ꢀ
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) ( 30 PPMꢂ/C)
R – X7R ( 15ꢀ) (-55/C + 125/C)
P– X5R ( 15ꢀ) (-55/C + 85/C)
U – Z5U (+22ꢀ, -56ꢀ) (+10/C + 85/C)
C – 0.25pF K – 10ꢀ
V – Y5V (+22ꢀ, -82ꢀ) (-30/C + 85/C)
D – 0.5pF
F – 1ꢀ
G – 2ꢀ
M – 20ꢀ
P – (GMV) – special order only
Z – +80ꢀ, -20ꢀ
VOLTAGE
1 - 100V 3 - 25V
1 - 100V
3 - 25V
2 - 200V 4 - 16V
2 - 200V 4 - 16V
5 - 50V 8 - 10V
5 - 50V 8 - 10V
6 - 35V 9 - 6.3V
7 - 4V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)
7 - 4V
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
9 - 6.3V
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