Datasheet > C1608C0G1H4R7BT

C1608C0G1H4R7BT

更新时间： 2023-01-03 02:37:39

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
72页	1381K
描述
Ceramic Capacitor, Multilayer, Ceramic, 50V, 2.13% +Tol, 2.13% -Tol, C0G, 30ppm/Cel TC, 0.0000047uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT

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C1608C0G1H4R7BT 数据手册

General

Specifications

C Series – General Application

Appendix - 1a

Appendix - 1b

P.C. Board for reliability test

Applied for C0603, C1005, C1608, C2012, C3216

Applied for C3225, C4532, C5750

100 mm

Copper

Solder Resist

Slit

Solder Resist

Copper

Appendix - 2a

Appendix - 2b

P.C. Board for bending test

Applied for C0603, C1005

Applied for C1608, C2012, C3216, C3225, C4532, C5750

100 mm

Copper

Solder resist

Solder Resist

Copper

Case Code

Dimensions (mm)

Material: Glass Epoxy (As per JIS C6484 GE4)

JIS

EIA

C0603

C1005

C1608

C2012

C3216

C3225

C4532

C5750

CC0201

CC0402

CC0603

CC0805

CC1206

CC1210

CC1812

CC2220

0.3

0.4

1.0

1.2

2.2

3.5

4.5

0.8

1.5

3.0

4.0

5.0

7.0

8.0

0.3

0.5

1.2

1.65

2.0

2.9

3.7

5.6

P.C. Board thickness: Appendix-2a

0.8mm

1.6mm

Appendix-1a, 1b, 2b

Copper (thickness 0.035mm)

Solder resist

TDK MLCC US Catalog

Page 71

Version B11

1...66 67 686970 71 72

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