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C1608C0G1H392K080AA_17 PDF预览

C1608C0G1H392K080AA_17

更新时间: 2024-11-20 01:10:43
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 186K
描述
Multilayer Ceramic Chip Capacitors

C1608C0G1H392K080AA_17 数据手册

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Creation Date : April 20, 2017 (GMT)  
Multilayer Ceramic Chip Capacitors  
C1608C0G1H102K080AA  
TDK item description C1608C0G1H102KT****  
Applications  
Commercial Grade  
Feature  
Series  
Status  
General General (Up to 50V)  
C1608 [EIA 0603]  
Production (Not Recommended for New Design)  
Size  
Length(L)  
1.60mm ±0.10mm  
Width(W)  
0.80mm ±0.10mm  
0.80mm ±0.10mm  
0.20mm Min.  
Thickness(T)  
Terminal Width(B)  
Terminal Spacing(G)  
0.30mm Min.  
0.70mm to 1.00mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
Recommended Land Pattern (PA)  
Recommended Land Pattern (PB)  
Recommended Land Pattern (PC)  
0.80mm to 1.00mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
0.60mm to 0.80mm(Flow Soldering)  
0.60mm to 0.80mm(Reflow Soldering)  
Electrical Characteristics  
Capacitance  
1nF ±10%  
50VDC  
Rated Voltage  
Temperature Characteristic  
Q (Min.)  
C0G(0±30ppm/°C)  
1000  
Insulation Resistance (Min.)  
10000MΩ  
Other  
Wave (Flow)  
Reflow  
Soldering Method  
AEC-Q200  
No  
Packing  
Punched (Paper)Taping [180mm Reel]  
4000pcs  
Package Quantity  
! Images are for reference only and show exemplary products.  
! This PDF document was created based on the data listed on the TDK Corporation website.  
! All specifications are subject to change without notice.  
Copyright(c) TDK Corporation. All rights reserved.  

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