Datasheet > C1412NCPA

C1412NCPA

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
美国微芯 - MICROCHIP		驱动器
页数	文件大小	规格书
16页	344K
描述
2A High-Speed MOSFET Drivers

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C1412NCPA 数据手册

TC1412/TC1412N

8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)

Units

Dimension Limits

INCHES*

NOM

MILLIMETERS

MIN

MAX

MIN

NOM

MAX

Number of Pins

Pitch

Top to Seating Plane

Molded Package Thickness

Base to Seating Plane

Shoulder to Shoulder Width

Molded Package Width

Overall Length

Tip to Seating Plane

Lead Thickness

Upper Lead Width

Lower Lead Width

Overall Row Spacing

Mold Draft Angle Top

Mold Draft Angle Bottom

.100

.155

.130

2.54

3.94

3.30

.140

.170

.145

3.56

2.92

4.32

3.68

.115

.015

.300

.240

.360

.125

.008

.045

.014

.310

0.38

7.62

6.10

9.14

3.18

0.20

1.14

0.36

7.87

.313

.250

.373

.130

.012

.058

.018

.370

.325

.260

.385

.135

.015

.070

.022

.430

7.94

6.35

9.46

3.30

0.29

1.46

0.46

9.40

8.26

6.60

9.78

3.43

0.38

1.78

0.56

10.92

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: MS-001

Drawing No. C04-018

DS21391C-page 10

 2003 Microchip Technology Inc.

1...7 8 91011 12 13...16

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