5秒后页面跳转
捷配首页

Datasheet > 电容器 > 固定电容器> C1210C103K1RAC
C1210C103K1RAC PDF预览

C1210C103K1RAC

更新时间： 2024-11-18 22:28:07
品牌 Logo 应用领域
基美 - KEMET 电容器固定电容器
页数 文件大小 规格书
4页 60K
描述
CERAMIC CHIP CAPACITORS

阅读下载

中文翻译

获取价格

C1210C103K1RAC 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：1210
包装说明：, 1210Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8532.24.00.20
风险等级：5.22电容：0.01 µF
电容器类型：CERAMIC CAPACITOR介电材料：CERAMIC
高度：0.78 mmJESD-609代码：e3
长度：3.2 mm安装特点：SURFACE MOUNT
多层：Yes负容差：10%
端子数量：2最高工作温度：125 °C
最低工作温度：-55 °C封装形状：RECTANGULAR PACKAGE
封装形式：SMT包装方法：TR, EMBOSSED PLASTIC, 7/13 INCH
正容差：10%额定（直流）电压（URdc）：100 V
尺寸代码：1210表面贴装：YES
温度特性代码：X7R温度系数：15% ppm/ °C
端子面层：Matte Tin (Sn) - with Nickel (Ni) barrier端子形状：WRAPAROUND
宽度：2.5 mmBase Number Matches：1

C1210C103K1RAC 数据手册

 浏览型号C1210C103K1RAC的Datasheet PDF文件第2页浏览型号C1210C103K1RAC的Datasheet PDF文件第3页浏览型号C1210C103K1RAC的Datasheet PDF文件第4页 
KEMET®  
CERAMIC CHIP CAPACITORS  
FEATURES  
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics  
• Tape and reel packaging per EIA481-1. (See page  
• 10, 16, 25, 50, 100 and 200 Volts  
• Standard End Metalization: Tin-plate over nickel  
barrier  
61 for specific tape and reel information.) Bulk  
Cassette packaging (0402, 0603, 0805 only) per  
IEC60286-6 and EIAJ 7201.  
• Available Capacitance Tolerances: ±0.10 pF; ±0.25  
pF; ±0.5 pF; ±1% ; ±2% ; ±5% ; ±10% ; ±20% ; and  
+80% -20%  
CAPACITOR OUTLINE DRAWINGS  
TIN PLATE  
L
W
B
T
NICKEL PLATE  
S
CONDUCTIVE  
METALLIZATION  
ELECTRODES  
DIMENSIONS—MILLIMETERS AND (INCHES)  
METRIC  
SIZE CODE  
(Ref only)  
L #  
W #  
B
S
MOUNTING  
TECHNIQUE  
Solder Reflow  
EIA  
SIZE CODE  
LENGTH  
WIDTH  
BANDWIDTH  
MIN. SEPARATION  
1.0 (.04) ± .05(.002)  
0.5 (.02) ± .05 (.002)  
0.20 (0.008)-0.40 (0.016)  
0.3 (.012)  
0402*  
0603*  
0805*  
1206*  
1210*  
1812  
1005  
1608  
2012  
3216  
3225  
4532  
4564  
5650  
5664  
1.6 (.063) ± 0.15 (.006)  
2.0 (.079) ± 0.2 (.008)  
3.2 (.126) ± 0.2 (.008)  
3.2 (.126) ± 0.2 (.008)  
4.5 (.177) ± 0.3 (.012)  
4.5 (.177) ± 0.3 (.012)  
5.6 (.220) ± 0.4 (.016)  
5.6 (.220) ± 0.4 (.016)  
0.8 (.032) ± 0.15 (.006)  
1.25 (.049) ± 0.2 (.008)  
1.6 (.063) ± 0.2 (.008)  
2.5 (.098) ± 0.2 (.008)  
3.2 (.126) ± 0.3 (.012)  
6.4 (.252) ± 0.4 (.016)  
5.0 (.197) ± 0.4 (.016)  
6.3 (.248) ± 0.4 (.016)  
0.35 (.014) ±0.15 (.006)  
0.5 (.02) ±.25 (.010)  
0.5 (.02) ±.25 (.010)  
0.5 (.02) ±.25 (.010)  
0.6 (.024) ±.35 (.014)  
0.6 (.024) ±.35 (.014)  
0.6 (.024) ±.35 (.014)  
0.6 (.024) ±.35 (.014)  
0.7 (.028)  
0.75 (.030)  
N/A  
See pages  
48-52 for  
thickness  
Solder Wave †  
or  
Solder Reflow  
N/A  
dimensions.  
N/A  
N/A  
1825*  
2220  
Solder  
Reflow  
N/A  
N/A  
2225  
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk cassette, see page 65.)  
#Note: These thicknesses are EIA maximums. Most chips are considerably thinner. Consult factory for details. Also, some extended values may be slightly thicker than EIA maximums.  
† For extended value 1210 case size – solder reflow only.  
(Standard Chips - For  
Military see page 55)  
CAPACITOR ORDERING INFORMATION  
C 0805 C 103 K 5 R A C*  
CERAMIC  
SIZE CODE  
END METALLIZATION  
C-Standard  
SPECIFICATION  
C - Standard  
CAPACITANCE CODE  
(Tin-plated nickel barrier)  
FAILURE RATE LEVEL  
A- Not Applicable  
Expressed in Picofarads (pF)  
TEMPERATURE CHARACTERISTIC  
Designated by Capacitance  
First two digits represent significant figures.  
Third digit specifies number of zeros. (Use 9  
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)  
(Example: 2.2pF = 229 or 0.50 pF = 508)  
CAPACITANCE TOLERANCE  
Change Over Temperature Range  
G – C0G (NP0) (±30 PPM/°C)  
R – X7R (±15% ) (-55°C + 125°C)  
P– X5R (±15% ) (-55°C + 85°C)  
U – Z5U (+22% , -56% ) (+10°C + 85°C)  
V – Y5V (+22% , -82% ) (-30°C + 85°C)  
VOLTAGE  
B – ±0.10pF J – ±5%  
C – ±0.25pF K – ±10%  
D – ±0.5pF  
F – ±1%  
G – ±2%  
M – ±20%  
P – (GMV) – special order only  
Z – +80% , -20%  
1 - 100V  
2 - 200V  
5 - 50V  
3 - 25V  
4 - 16V  
8 - 10V  
9 - 6.3V  
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)  
49  
KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  
1234

中文翻译

下载PDF

C1210C103K1RAC 替代型号

型号 品牌 替代类型 描述 数据表
C1210C103K1RACTU KEMET

完全替代

 Capacitor, Ceramic, Chip, General Purpose, 0.
C1210C103K1RACTM KEMET

类似代替

 Capacitor, Ceramic, Chip, General Purpose, 0.

与C1210C103K1RAC相关器件

型号 品牌 获取价格 描述 数据表
C1210C103K1RAC7025 KEMET

获取价格

 		Capacitor, Ceramic, Chip, General Purpose, 0.
C1210C103K1RAC7800 KEMET

获取价格

 		Capacitor, Ceramic, Chip, General Purpose, 0.
C1210C103K1RACAUTO KEMET

获取价格

 		Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.01uF, Sur
C1210C103K1RACTM KEMET

获取价格

 		Capacitor, Ceramic, Chip, General Purpose, 0.
C1210C103K1RACTU KEMET

获取价格

 		Capacitor, Ceramic, Chip, General Purpose, 0.
C1210C103K1RAL3325 KEMET

获取价格

 		Ceramic Capacitor, Multilayer, Ceramic, 100V, 10% +Tol, 10% -Tol, X7R, -/+15ppm/Cel TC, 0.
C1210C103K1UAC KEMET

获取价格

 		CERAMIC CHIP/STANDARD
C1210C103K1VAC KEMET

获取价格

 		CERAMIC CHIP/STANDARD
C1210C103K2GAC KEMET

获取价格

 		CERAMIC CHIP/STANDARD
C1210C103K2RAC KEMET

获取价格

 		CERAMIC CHIP CAPACITORS

与C1210C103K1RAC相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证