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C1206C100CDRAC PDF预览

C1206C100CDRAC

更新时间: 2024-01-14 00:49:09
品牌 Logo 应用领域
基美 - KEMET 高压
页数 文件大小 规格书
9页 1651K
描述
CERAMIC CHIP / HIGH VOLTAGE

C1206C100CDRAC 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:, 1206Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8532.24.00.20
风险等级:5.61电容:0.00001 µF
电容器类型:CERAMIC CAPACITOR介电材料:CERAMIC
高度:1.6 mmJESD-609代码:e3
长度:3.2 mm多层:Yes
负容差:20%端子数量:2
最高工作温度:125 °C最低工作温度:-55 °C
封装形式:SMT包装方法:TR, Plastic, 7 Inch
正容差:20%额定(直流)电压(URdc):2000 V
尺寸代码:1206温度特性代码:X7R
温度系数:-/+15ppm/Cel ppm/ °C端子面层:MATTE TIN OVER NICKEL
宽度:1.6 mm

C1206C100CDRAC 数据手册

 浏览型号C1206C100CDRAC的Datasheet PDF文件第3页浏览型号C1206C100CDRAC的Datasheet PDF文件第4页浏览型号C1206C100CDRAC的Datasheet PDF文件第5页浏览型号C1206C100CDRAC的Datasheet PDF文件第7页浏览型号C1206C100CDRAC的Datasheet PDF文件第8页浏览型号C1206C100CDRAC的Datasheet PDF文件第9页 
TANTALUM, CERAMIC AND  
ALUMINUM CHIP CAPACITORS  
Packaging Information  
Performance Notes  
1. Cover Tape Break Force: 1.0 Kg Minimum.  
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:  
Tape Width  
8 mm  
Peel Strength  
0.1 Newton to 1.0 Newton (10g to 100g)  
12 mm  
0.1 Newton to 1.3 Newton (10g to 130g)  
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier  
tape shall be 165to 180from the plane of the carrier tape. During peeling, the carrier and/or cover tape  
shall be pulled at a velocity of 300 10 mm/minute.  
3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")  
reels (with C-7280). Note that 13reels are preferred.  
4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.  
Refer to EIA-556.  
Embossed Carrier Tape Configuration: Figure 1  
Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)  
Constant Dimensions — Millimeters (Inches)  
Tape Size  
D0  
E
P0  
P2  
T Max  
T1 Max  
8 mm  
and  
12 mm  
1.5  
+0.10 -0.0  
(0.059  
1.75 0.10  
4.0 0.10  
2.0 0.05  
0.600  
0.100  
(0.069 0.004) (0.157 0.004) (0.079 0.002) (0.024)  
(0.004)  
+0.004, -0.0)  
Variable Dimensions — Millimeters (Inches)  
Tape Size  
Pitch  
B1 Max.  
Note 1  
D1 Min.  
Note 2  
F
P1  
R Min. T2 Max  
Note 3  
W
A0B0K0  
Note 4  
8 mm  
Single  
4.4  
1.0  
3.5 0.05  
4.0 0.10  
25.0  
2.5  
8.0 0.30  
(4 mm)  
(0.173)  
(0.039) (0.138 0.002) (0.157 0.004) (0.984) (0.098) (.315 0.012)  
12 mm  
Double  
(8 mm)  
8.2  
(0.323)  
1.5 5.5 0.05 8.0 0.10 30.0 4.6 12.0 0.30  
(0.059) (0.217 0.002) (0.315 0.004) (1.181) (0.181) (0.472 0.012)  
NOTES  
1. B1 dimension is a reference dimension for tape feeder clearance only.  
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of  
embossment location and hole location shall be applied independent of each other.  
3. Tape with components shall pass around radius Rwithout damage (see sketch A). The minimum trailer length (Fig. 2) may require  
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)  
4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not pro-  
trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical  
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm  
maximum in the pocket (not applicable to vertical clearance.)  
94  
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300  

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