BZT52C2V0Q

更新时间： 2024-02-17 17:04:27

品牌	Logo	应用领域
美台 - DIODES		二极管齐纳二极管
页数	文件大小	规格书
3页	74K
描述
SURFACE MOUNT ZENER DIODE

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中文翻译

获取价格

技术参数
数据手册

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BZT52C2V0Q 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	compliant	风险等级：	5.61
Is Samacsys：	N	二极管类型：	ZENER DIODE
JESD-609代码：	e3	峰值回流温度（摄氏度）：	NOT SPECIFIED
端子面层：	Matte Tin (Sn)	处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

BZT52C2V0Q 数据手册

BZT52C2V4 - BZT52C39

SURFACE MOUNT ZENER DIODE

Features

Planar Die Construction

500mW Power Dissipation on Ceramic PCB

General Purpose, Medium Current

Ideally Suited for Automated Assembly

Processes

SOD-123

Dim

Min

3.55

2.55

1.40

—

Max

3.85

2.85

1.70

1.35

Mechanical Data

Case: SOD-123, Plastic

UL Flammability Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020A

Terminals: Solderable per MIL-STD-202,

Method 208

0.55 Typical

0.25

0.11 Typical

—

Polarity: Cathode Band

Marking: See Below

Weight: 0.01 grams (approx.)

Ordering Information: See Page 4

—

0.10

0°

8°

All Dimensions in mm

@ T_A= 25°C unless otherwise specified

Maximum Ratings

Characteristic

Symbol

V_F

Value

0.9

Unit

Forward Voltage (Note 2)

Power Dissipation (Note 1)

@ I_F= 10mA

P_d

500

°C/W

°C

R_qJA

Thermal Resistance, Junction to Ambient Air (Note 1)

Operating and Storage Temperature Range

305

T_j,T_STG

-65 to +150

Notes:

1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm².

2. Short duration test pulse used to minimize self-heating effect.

Marking Information

XX = Product Type Marking Code (See Page 2)

YM = Date Code Marking

Y = Year (ex: N = 2002)

M = Month (ex: 9 = September)

Date Code Key

Year

1998

1999

2000

2001

2002

2003

2004

2005

Code

Month

Code

Jan

Feb

March

Apr

May

Jun

Jul

Aug

Sep

Oct

Nov

Dec

DS18004 Rev. 19 - 2

1 of 3

BZT52C2V4 - BZT52C39

12 3

中文翻译

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