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BUW324-0728-18AB95 PDF预览

BUW324-0728-18AB95

更新时间: 2024-01-24 11:33:21
品牌 Logo 应用领域
ACTEL /
页数 文件大小 规格书
8页 1242K
描述
IC Socket, BGA324, 324 Contact(s), ROHS COMPLIANT

BUW324-0728-18AB95 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:ROHS COMPLIANTReach Compliance Code:compliant
风险等级:5.84联系完成配合:GOLD/TIN
联系完成终止:GOLD/TIN触点材料:BERYLLIUM COPPER
设备插槽类型:IC SOCKET使用的设备类型:BGA324
JESD-609代码:e4/e3触点数:324
Base Number Matches:1

BUW324-0728-18AB95 数据手册

 浏览型号BUW324-0728-18AB95的Datasheet PDF文件第1页浏览型号BUW324-0728-18AB95的Datasheet PDF文件第2页浏览型号BUW324-0728-18AB95的Datasheet PDF文件第3页浏览型号BUW324-0728-18AB95的Datasheet PDF文件第5页浏览型号BUW324-0728-18AB95的Datasheet PDF文件第6页浏览型号BUW324-0728-18AB95的Datasheet PDF文件第7页 
Socket Mounting Recommendations and Reflow Profile  
Stencil  
Table 1 shows the recommended stencil dimensions. A laser-cut, electro-polished and Ni-plated  
stainless steel stencil is recommended to give the most consistent paste release. The apertures  
can be made round except for smaller pitches, where square apertures are recommended.  
Remember to keep the stencil small enough to fit within the keep-out area of the socket, but yet  
have provisions to remove it from the PCB once the paste has been applied.  
Table 1: Recommended stencil dimensions.  
Device Pitch  
(mm)  
1.27  
PCB Pad Diameter  
(mm / in)  
Stencil Thickness  
(mm/in)  
Stencil Aperture  
(mm/in)  
min. 0.60 / 0.023  
min. 0.50 / 0.019  
min. 0.40 / 0.016  
min. 0.35 / 0.014  
min. 0.35 / 0.014  
min. 0.30 / 0.012  
0.15 / 0.006  
0.15 / 0.006  
0.13 / 0.005  
0.13 / 0.005  
0.13 / 0.005  
0.13 / 0.005  
round 0.66 / 0.026  
round 0.55 / 0.022  
round 0.44 / 0.017  
square 0.39 / 0.015  
square 0.39 / 0.015  
square 0.33 / 0.013  
1.00  
0.80  
0.75  
0.65  
0.50  
Solder Paste  
E-tec recommends using solder paste without ( or <0.5%) silver (Ag) to reduce the solder’s  
wetting ability and prevent the paste from running up the pins, thus maximizing the volume of  
solder left on the pads. Brands such as Qualitek (www.qualitek.com) or Alpha Metals  
(www.alphametals.com) produce such solder paste on customer request. For Sn/Pb solder paste  
we recommend Ecorel 803S offered by Avantec (www.avantec.dehon.com).  
Reflow Profile  
Both standard Sn-Pb eutectic and Pb-free reflow profiles are shown below.  
E-tec Interconnect Ltd, Industrial Zone C, CH-1072 Forel (Lavaux), Switzerland  
Phone +41-21-781 08 10 · www.e-tec.com · info@e-tec.com  
2
E-tec Socket Mounting Recommendations  
PRELIMINARY  

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