AC-SPECIFICATIONS (CONT)
At VCC = ±5V, RLOAD = 200Ω (BUF600) and 100Ω (BUF601), RSOURCE = 50Ω, and TAMB = +25°C, unless otherwise noted.
BUF600AP, AU
BUF601AU
TYP
PARAMETER
CONDITIONS
MIN
TYP
MAX
MIN
MAX
UNITS
HARMONIC DISTORTION
Second Harmonic
Third Harmonic
Second Harmonic
Third Harmonic
f = 10MHz, VO = 1.4Vp-p
f = 30MHz, VO = 1.4Vp-p
f = 50MHz, VO = 1.4Vp-p
–65
–64
–51
–56
–43
–48
–65
–67
–59
–62
–53
–54
dBc
dBc
dBc
dBc
dBc
dBc
Second Harmonic
Third Harmonic
GAIN FLATNESS PEAKING
VO = 0.4Vp-p, DC to 30MHz
VO = 0.4Vp-p, 30MHz to 300MHz
0.01
0.3
0.005
0.1
dB
dB
LINEAR PHASE DEVIATION
VO = 0.4Vp-p, DC to 30MHz
VO = 0.4Vp-p, 30 to 300MHz
5.5
55
3.8
45
Degrees
Degrees
TIME DOMAIN
RISE TIME
10% to 90%, 700ps
1.4Vp-p Step
0.82
0.97
1.18
0.87
0.95
1.13
ns
ns
ns
2.8Vp-p Step
5.0Vp-p Step
SLEW RATE
VO = 1.4Vp-p
VO = 2.8Vp-p
VO = 5.0Vp-p
1500
2400
3400
1500
2400
3600
V/µs
V/µs
V/µs
FUNCTIONAL DESCRIPTION
PIN CONFIGURATION
FUNCTION
DESCRIPTION
Top View
DIP/SO-8
In
Analog Input
Out
+VCC
–VCC
Analog Output
Positive Supply Voltage; typical +5VDC
Negative Supply Voltage; typical –5VDC
8
+VCC
NC
NC
In
1
2
3
4
Out
7
NC
6
ELECTROSTATIC
DISCHARGE SENSITIVITY
NC
5
–VCC
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
BUF600, BUF601
ABSOLUTE MAXIMUM RATINGS
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
Power Supply Voltage.......................................................................... ±6V
Input Voltage(1) ......................................................................... ±VCC ±0.7V
Operating Temperature..................................................... –40°C to +85°C
Storage Temperature ...................................................... –40°C to +125°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s)................................................ +300°C
NOTE: (1) Inputs are internally diode-clamped to ±VCC.
PACKAGE/ORDERING INFORMATION
PACKAGE
DRAWING
NUMBER(1)
TEMPERATURE
RANGE
PRODUCT
PACKAGE
BUF600AP
BUF600AU
BUF601AU
Plastic 8-Pin DIP
SO-8 Surface Mount
SO-8 Surface Mount
006
182
182
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
®
3
BUF600, 601
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