ꢠꢄ ꢡ ꢢ ꢣꢤ ꢢ ꢢ
ꢠꢄ ꢡ ꢢ ꢣꢤ ꢢ ꢣ
www.ti.com
SBOS337A − OCTOBER 2006 − REVISED OCTOBER 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
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ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +20V
S
Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6V
SD
Signal Input Terminals,
BIAS:
Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5V to V +0.5V
S
SCL, SDA, A0, A1:
Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5V to +6V
Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
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Output Short Circuit
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Operating Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to +95°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C
ESD Rating:
Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000V
Charged-Device Model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V
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Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is
not supported.
Short-circuit to ground.
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ORDERING INFORMATION
PRODUCT
BUF01900
BUF01900
BUF01901
BUF01901
PACKAGE-LEAD
DFN-10
PACKAGE DESIGNATOR
PACKAGE MARKING
DRC
PW
BOO
F01900
BOP
TSSOP-8
DFN-10
DRC
PW
TSSOP-8
F01901
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For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATIONS
BUF01901
BUF01900
1
2
3
4
5
10 SDA
1
2
3
4
5
10 SDA
VS
NC
VS
VCOM
Exposed
Thermal
Die Pad
on
Exposed
Thermal
Die Pad
on
9
8
7
6
SCL
A0
9
8
7
6
SCL
A0
BIAS
GND
DGND
BIAS
GND
A1
A1
Underside
Underside
VSD
VSD
DGND
DFN−10
DFN−10
BUF01900
BUF01901
VS
1
2
3
4
8
7
6
5
SDA
1
2
3
4
8
7
6
5
VS
NC
SDA
VCOM
BIAS
GND
SCL
A0
SCL
A0
BIAS
GND
VSD
VSD
NC = No connection
TSSOP−8
TSSOP−8
2