BR25H320xxx-5AC Series
Absolute Maximum Ratings
Parameter
Symbol
VCC
Rating
Unit
V
Remark
Ta = 25 °C
Supply Voltage
-0.3 to +6.5
Ta = 25 °C. The maximum value of terminal
voltage is not over than 6.5 V. When the pulse
width is 50 ns or less, the minimum value of
terminal voltage is -1.0 V.
Terminal Voltage
-
-0.3 to VCC+1.0
V
Electro Static Discharge
(Human Body Model)
Maximum Output Low Current
(SO)
Maximum Output HIGH Current
(SO)
VESD
IOLMAX
IOHMAX
-3000 to +3000
V
Ta = 25 °C
Ta = 25 °C
Ta = 25 °C
10
mA
mA
-10
Maximum Junction Temperature
Tjmax
Tstg
150
°C
°C
-
-
Storage Temperature Range
-65 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between
pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the
absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties
of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size
and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 2)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 4)
2s2p(Note 5)
SOP8
197.4
21
109.8
19
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
°C/W
°C/W
ΨJT
SOP-J8
149.3
18
76.9
11
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
°C/W
°C/W
ΨJT
TSSOP-B8
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
251.9
31
152.1
20
°C/W
°C/W
ΨJT
MSOP8
Junction to Ambient
Junction to Top Characterization Parameter(Note 3)
θJA
284.1
21
135.4
11
°C/W
°C/W
ΨJT
(Note 2) Based on JESD51-2A (Still-Air)
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
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TSZ22111 • 15 • 001
TSZ02201-0G1G0G100600-1-2
05.Jan.2022 Rev.002
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