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BLM18EG121SN1J PDF预览

BLM18EG121SN1J

更新时间: 2024-01-12 08:06:42
品牌 Logo 应用领域
村田 - MURATA /
页数 文件大小 规格书
15页 362K
描述
Ferrite Chip, 1 Function(s), 2A, EIA STD PACKAGE SIZE 0603, 2 PIN

BLM18EG121SN1J 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:0603
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8504.50.80.00风险等级:5.24
其他特性:MONOLITHIC TYPE外壳代码:0603
构造:Chip Bead最大直流电阻:0.04 Ω
滤波器类型:FERRITE CHIP最大频率:1000 MHz
最小频率:100 MHz高度:0.8 mm
JESD-609代码:e3长度:1.6 mm
材料:Ferrite安装类型:SURFACE MOUNT
功能数量:1最高工作温度:125 °C
最低工作温度:-55 °C输出阻抗:145 OHM Ω
包装方法:TAPE物理尺寸:L1.6XB0.8XH0.8 (mm)/L0.063XB0.031XH0.031 (inch)
额定电流:2 A子类别:Other Filters
端子面层:Tin (Sn)宽度:0.8 mm
Base Number Matches:1

BLM18EG121SN1J 数据手册

 浏览型号BLM18EG121SN1J的Datasheet PDF文件第2页浏览型号BLM18EG121SN1J的Datasheet PDF文件第3页浏览型号BLM18EG121SN1J的Datasheet PDF文件第4页浏览型号BLM18EG121SN1J的Datasheet PDF文件第5页浏览型号BLM18EG121SN1J的Datasheet PDF文件第6页浏览型号BLM18EG121SN1J的Datasheet PDF文件第7页 
Noise Suppression Products/EMI Suppression Filters > EMIFILr (Capacitor type) > Single Circuit Type for Large Current  
1
Data Sheet  
EMIFIL (Capacitor type)  
r
Single Circuit Type for Large Current  
NFM18PS Series (0603 Size)  
Dimensions  
Insertion Loss Characteristics (Main Items)  
c
c
c
c
(5±Ω - 5±Ω)  
±
(2)  
(2)  
2±  
+±.2  
–±.1  
NFM18PS474R±J3  
±.15  
(3)  
(1)  
±.2 min.  
NFM18PS1±5R±J3  
4±  
1.6±±.1  
6±  
8±  
+±.2  
–±.1  
±.8  
±.4±±.1  
1±±  
±.1  
: Electrode  
(in mm)  
1
1±  
1±±  
1±±±  
6±±±  
Frequency (MHz)  
Equivalent Circuit  
Packaging  
c
Code  
Packaging  
Minimum Quantity  
D
180mm Paper Tape  
Bulk(Bag)  
4000  
500  
B
Input (Output)  
(1)  
Output (Input)  
(3)  
No polarity.  
GND  
(2)  
Rated Value ( : packaging code)  
p
Operating  
Temperature Range  
Part Number  
Capacitance  
Rated Current  
Rated Voltage  
Insulation Resistance (min.)  
NFM18PS474R0J3  
NFM18PS105R0J3  
Number of Circuit: 1  
0.47µF 20ꢀ  
1.0µF 20ꢀ  
2A  
2A  
6.3Vdc  
6.3Vdc  
1000M ohm  
500M ohm  
-55 to +125°C  
-55 to +105°C  
p
p
Caution/Notice  
c !  
Caution (Rating)  
Notice  
!
Do not use products beyond the rated current and  
rated voltage as this may create excessive heat  
and deteriorate the insulation resistance.  
Solderability of Tin plating termination chip might be  
deteriorated when low temperature soldering profile  
where peak solder temperature is below the Tin melting  
point is used. Please confirm the solderability of Tin  
plating termination chip before use.  
oThis data sheet is applied for CHIP EMIFILr used for General Electronics equipment for your design.  
!Note:  
1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it  
may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.  
2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product  
specifications or transact the approval sheet for product specifications before ordering.  
2012.9.6  
http://www.murata.com/  

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