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BLM15BB220SH1D PDF预览

BLM15BB220SH1D

更新时间: 2024-02-06 12:48:24
品牌 Logo 应用领域
村田 - MURATA /
页数 文件大小 规格书
8页 132K
描述
Chip Ferrite Bead

BLM15BB220SH1D 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:0402
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8504.50.80.00Factory Lead Time:7 weeks
风险等级:0.78Samacsys Description:BLM15_H1D Series EMI Suppression Filter 22Ω±25% at 100MHz 300mA @85℃
外壳代码:0402构造:Chip Bead
最大直流电阻:0.2 Ω滤波器类型:FERRITE CHIP
最大频率:100 MHz最小频率:100 MHz
高度:0.5 mmJESD-609代码:e3
长度:1 mm材料:Ferrite
安装类型:SURFACE MOUNT功能数量:1
最高工作温度:125 °C最低工作温度:-55 °C
输出阻抗:22 OHM Ω包装方法:TAPE
物理尺寸:L1.0XB0.5XH0.5 (mm)/L0.039XB0.02XH0.02 (inch)额定电流:0.3 A
子类别:Other Filters端子面层:Tin (Sn)
宽度:0.5 mmBase Number Matches:1

BLM15BB220SH1D 数据手册

 浏览型号BLM15BB220SH1D的Datasheet PDF文件第2页浏览型号BLM15BB220SH1D的Datasheet PDF文件第3页浏览型号BLM15BB220SH1D的Datasheet PDF文件第4页浏览型号BLM15BB220SH1D的Datasheet PDF文件第5页浏览型号BLM15BB220SH1D的Datasheet PDF文件第6页浏览型号BLM15BB220SH1D的Datasheet PDF文件第8页 
Reference Only  
Reference Spec.No.JENF243A-9103H-01  
9-4.Solder Volume  
P7/8  
Solder shall be used not to be exceeded as shown below.  
Upper Limit  
Recommendable  
t
1/3TtT  
(T:Chip thickness)  
Accordingly increasing the solder volume, the mechanical stress to product is also increased.  
Exceeding solder volume may cause the failure of mechanical or electrical performance.  
9-5.Attention regarding P.C.B. bending  
The following shall be considered when designing and laying out P.C.B.'s.  
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.  
<Products direction>  
a
Products shall be located in the sideways  
b
direction (Length:ab) to the mechanical  
stress.  
Poor example  
Good example  
(2) Components location on P.C.B. separation.  
It is effective to implement the following measures, to reduce stress in separating the board.  
It is best to implement all of the following three measures; however, implement as many measures as  
possible to reduce stress.  
Contents of Measures  
Stress Level  
(1) Turn the mounting direction of the component parallel to the board separation surface.  
(2) Add slits in the board separation part.  
(3) Keep the mounting position of the component away from the board separation surface.  
A
A
A
>
>
>
D *1  
B
C
C
Perforation  
B
D
A
Slit  
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.  
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.  
(3) Mounting Components Near Screw Holes  
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs  
during the tightening of the screw. Mount the component in a position as far away from the screw holes as  
possible.  
Recommended  
Screw Hole  
9-6.Mounting density  
Add special attention to radiating heat of products when mounting the inductor near the products with heating.  
The excessive heat by other products may cause deterioration at joint of this product with substrate.  
MURATA MFG.CO.,LTD.  

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