N-Channel Enhancement Mode MOSFET
BL045N10TH
Electrical Characteristics (@ TA = 25°C unless otherwise specified)
Symbol
Parameter
Test Condition
Min. Typ. Max. Unit
Static Characteristics
VDSS
IDSS
IGSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
VGS = 0V, ID = 1mA
VDS = 100V, VGS = 0V
VGS = ±20V, VDS = 0V
VGS = 10V,ID = 100A
VGS = 6V,ID = 50A
VDS = VGS, ID = 150μA
-
100
-
-
-
1
V
μA
nA
mΩ
mΩ
V
-
-
-
±1 00
4.5
7.4
4
-
3.7
5
RDS(ON)
Static Drain-Source On-resistance *2
-
VGS(th)
RG
Gate Threshold Voltage
Gate resistance
2
-
2.9
2.6
-
Ω
Dynamic Characteristics
CISS
COSS
CRSS
td(ON)
tr
Input Capacitance
-
-
-
-
-
-
-
6998 8410
VGS = 0V
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Turn-on Rise Time
VDS = 50V
f = 1.0MHz
892
40
35
18
45
55
1610
pF
ns
-
-
-
-
-
VDD =50V
VGS = 10V
RG = 1.6Ω
ID = 50A
td(OFF)
tf
Turn-Off Delay Time
Turn-Off Fall Time
Gate charge characteristics
QG
QGS
QGD
Total Gate-Charge
-
-
-
105
36.1
24.6
-
-
-
VDD = 50V
ID = 100A
VGS = 10V
Gate to Source Charge
Gate to Drain (Miller) Charge
nC
Source-Drain Diode Characteristics
VSD
ISD
Diode Forward Voltage *3
Diode Continuous Forward Current *5
Diode Pulse current
ISD = 10A, VGS = 0V
TC = 25°C
-
-
-
-
-
-
1.0
-
1.2
V
A
137
ISD, pulse
trr
TC = 25°C
-
548
A
Reverse recovery time
155
390
4.7
-
-
-
ns
nC
A
VR =50V IF = 30A,
di/dt=100A/us,
Qrr
Reverse recovery charge
Reverse recovery current
IRRM
Notes:
1. See fig.11
2. The data tested by surface mounted on suggest footprint
3. The data tested by pulsed, pulse width ≤ 300μs, duty cycle ≤ 2%
4. The EAS data shows Max. rating. The test condition is VDD = 50V, VGS = 10V, L = 1mH
5. The data is theoretically the same as ID and IDM, in real applications, should be limited by total power dissipation
MTM0393A: October 2021
www.gmesemi.com
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