Product Specification
Circuit Protection
SPARK GAP
BK1-MS SERIES
Recommended Soldering Conditions
Flow Soldering Conditions
Reflow Soldering Conditions
Air Priheat
Soldering
Cooling
Air Priheat
Soldering
Cooling
260℃
260℃
250
200
150
100
50
250
200
150
100
50
△T
△T
150~180℃
150~180℃
0
10 sec. or less
60 sec. or less
60~120 sec
0
60~120 sec
3~4 sec
1) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2) Temperature difference in high temperature part should be within 110℃.
3) After soldering, do not force cool, allow the parts to cool gradually.
Hand Soldering
Solder iron temperature: 350±5℃
Heating time: 3 seconds max.
General attention to soldering
● High soldering temperatures and long soldering times can cause leaching of the termination, decrease in
adherence strength, and the change of characteristic may occur.
● For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures
exceeding 200℃ to fewer than 50 seconds.
● Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash
thoroughly to remove any residue from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration
can cause cracking or a decrease in the adherence of the termination, we recommend that you use the
conditions below.
Frequency: 40kHz max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
www.yageo.com
Jul. 04, 2023 V.1