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BFC237019823

更新时间： 2024-02-26 13:24:16

品牌	Logo	应用领域
威世 - VISHAY		电容器薄膜电容器
页数	文件大小	规格书
18页	171K
描述
DC Film Capacitors MKT Radial Potted Type

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BFC237019823 数据手册

MKT 370

DC Film Capacitors

MKT Radial Potted Type

Vishay BCcomponents

Maximum allowed component temperature rise (ΔT)

as a function of the ambient temperature (T_amb) for voltage 63 V

Maximum allowed component temperature rise (ΔT)

as a function of the ambient temperature (T_amb) for voltages > 63 V

- 60

- 20

100

_amb(°C)

- 60

- 20

100

T_amb(°C)

HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY THICKNESS IN mW/°C

HEAT CONDUCTIVITY (mW/°C)

W_max.

(mm)

2.5

PITCH 5 mm

2.5

3.0

4.0

5.5

3.5

4.5

6.0

POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE

The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of

the free ambient temperature.

The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film

Capacitors”.

The component temperature rise (ΔT) can be measured (see section “Measuring the component temperature” for more details)

or calculated by ΔT = P/G:

• ΔT = Component temperature rise (°C)

• P = Power dissipation of the component (mW)

• G = Heat conductivity of the component (mW/°C)

MEASURING THE COMPONENT TEMPERATURE

A thermocouple must be attached to the capacitor body as in:

Thermocouple

The temperature is measured in unloaded (T_amb) and maximum loaded condition (T_C).

The temperature rise is given by ΔT = T_C- T_amb

To avoid radiation or convection, the capacitor should be tested in a wind-free box.

Document Number: 28108

Revision: 04-Aug-09

For technical questions, contact: dc-film@vishay.com

www.vishay.com

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