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BFC237018824 PDF预览

BFC237018824

更新时间: 2024-02-14 10:40:54
品牌 Logo 应用领域
威世 - VISHAY 电容器薄膜电容器
页数 文件大小 规格书
18页 171K
描述
DC Film Capacitors MKT Radial Potted Type

BFC237018824 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:, 2824
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8532.25.00.70风险等级:5.2
其他特性:RATED AC VOLTAGE(V) : 40电容:0.82 µF
电容器类型:FILM CAPACITOR介电材料:POLYESTER
高度:11 mmJESD-609代码:e3
长度:7.2 mm安装特点:THROUGH HOLE MOUNT
负容差:10%端子数量:2
最高工作温度:85 °C最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE封装形式:Radial
包装方法:TR, 14 INCH正容差:10%
额定(AC)电压(URac):40 V额定(直流)电压(URdc):63 V
尺寸代码:2824表面贴装:NO
端子面层:Tin (Sn)端子节距:5.08 mm
端子形状:WIRE宽度:6 mm
Base Number Matches:1

BFC237018824 数据手册

 浏览型号BFC237018824的Datasheet PDF文件第10页浏览型号BFC237018824的Datasheet PDF文件第11页浏览型号BFC237018824的Datasheet PDF文件第12页浏览型号BFC237018824的Datasheet PDF文件第14页浏览型号BFC237018824的Datasheet PDF文件第15页浏览型号BFC237018824的Datasheet PDF文件第16页 
MKT 370  
DC Film Capacitors  
MKT Radial Potted Type  
Vishay BCcomponents  
Maximum allowed component temperature rise (ΔT)  
as a function of the ambient temperature (Tamb) for voltage 63 V  
Maximum allowed component temperature rise (ΔT)  
as a function of the ambient temperature (Tamb) for voltages > 63 V  
16  
12  
8
16  
12  
8
4
0
4
0
- 60  
- 20  
20  
60  
100  
amb (°C)  
- 60  
- 20  
20  
60  
100  
Tamb (°C)  
T
HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY THICKNESS IN mW/°C  
HEAT CONDUCTIVITY (mW/°C)  
Wmax.  
(mm)  
2.5  
PITCH 5 mm  
2.5  
3.0  
4.0  
5.5  
3.5  
4.5  
6.0  
POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE  
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of  
the free ambient temperature.  
The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film  
Capacitors”.  
The component temperature rise (ΔT) can be measured (see section “Measuring the component temperature” for more details)  
or calculated by ΔT = P/G:  
• ΔT = Component temperature rise (°C)  
P = Power dissipation of the component (mW)  
G = Heat conductivity of the component (mW/°C)  
MEASURING THE COMPONENT TEMPERATURE  
A thermocouple must be attached to the capacitor body as in:  
Thermocouple  
The temperature is measured in unloaded (Tamb) and maximum loaded condition (TC).  
The temperature rise is given by ΔT = TC - Tamb  
.
To avoid radiation or convection, the capacitor should be tested in a wind-free box.  
Document Number: 28108  
Revision: 04-Aug-09  
For technical questions, contact: dc-film@vishay.com  
www.vishay.com  
89  

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