MKP339 X2
Vishay BCcomponents
www.vishay.com
SUB-CLAUSE NUMBER AND TEST
CONDITIONS
PERFORMANCE REQUIREMENTS
SUB-GROUP C1A PART OF SAMPLE OF
SUB-GROUP C1
4.4 Resistance to soldering heat
No pre-drying
Method: 1A
Solder bath: 280 °C 5 °C
Duration: 10 s
4.19 Component solvent resistance
Isopropylalcohol at room temperature
Method: 2
Immersion time: 5 min 0.5 min
Recovery time:
Min. 1 h, max. 2 h
4.4.2 Final measurements
Visual examination
No visible damage
Legible marking
Capacitance
|C/C| 5 % of the value measured initially.
Tangent of loss angle
Increase of tan : 0.008 for: C 1 μF or
0.005 for: C > 1 μF
Compared to values measured initially
Insulation resistance
As specified in section “Insulation
Resistance” of this specification
SUB-GROUP C1B PART OF SAMPLE OF
SUB-GROUP C1
Initial measurements
Capacitance
Tangent of loss angle:
For C 1 μF at 10 kHz
For C > 1 μF at 1 kHz
4.20 Solvent resistance of the marking
4.6 Rapid change of temperature
Isopropylalcohol at room temperature
Method: 1
Rubbing material: Cotton wool
Immersion time: 5 min 0.5 min
No visible damage
Legible marking
A = - 55 °C
B = + 110 °C
5 cycles
Duration t = 30 min
4.6.1 Inspection
4.7 Vibration
Visual examination
No visible damage
Mounting: see section “Mounting” of this
specification
Procedure B4
Frequency range: 10 Hz to 55 Hz
Amplitude: 0.75 mm or
acceleration 98 m/sꢀ
(whichever is less severe)
Total duration 6 h
4.7.2 Final inspection
Visual examination
No visible damage
4.9
Shock
Mounting: see section “Mounting” for more
information
Pulse shape: half sine
Acceleration: 490 m/sꢀ
Duration of pulse: 11 ms
Revision: 13-May-13
Document Number: 28138
1ꢀ
For technical questions, contact: rfi@vishay.com
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