Datasheet > BD99954GW

BD99954GW

更新时间： 2023-09-03 20:29:55

品牌	Logo	应用领域
罗姆 - ROHM		电池 PC
页数	文件大小	规格书
130页	3157K
描述
BD99954GW is a Battery Management LSI for 1-4 cell Lithium-Ion secondary battery, and available in a 40pin 0.40 mm pitch 5.0 mm x 5.0 mm QFN package and small 41-ball 0.4mm pitch 2.6mm x 3.0mm Wafer-Level CSP package which is designed to meet high degree demands for space-constraint equipment such as Low profile Notebook PC, Tablets and other applications. It provides a Dual-source Battery Charger, two port BC1.2 detection and a Battery Monitor with several alarm(INT#, PROCHOT#) outputs.Read more about Battery Charge ICs...

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

BD99954GW 数据手册

Datasheet

BD99954MWV, BD99954GW

4. Absolute Maximum Rating

Value

VBUS, VCC, SRN, SRP, ACN, ACP, BATT

LX1, LX2

ACGATE1, ACGATE2, BGATE, BOOT1, BOOT2,

HG1, HG2

-0.3 to 28V

-2 to 28V

-0.3 to 32V

Voltage range

(with respect to GND)

LX1-BOOT1,LX2-BOOT2

ACP-ACN, SRP-SRN

VBUS_DPI, VBUS_DMI, VBUS_ID, VBUS_DPO,

VBUS_DMO, VCC_DPI, VCC_DMI, VCC_ID,

VCC_DPO, VCC_DMO, ACOK, REGN, INT#,

PROCHOT#, IOUT, PMON, SCL, SDA, LG1, LG2

TSENSE, IADP/RESET, VREF

-0.3 to 6V

-0.3 to 0.3 V

-0.3 to 7.0 V

-0.3 to 2.1 V

150℃

-50 to 150℃

Junction temperature

Storage temperature

5. Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 4)}

2s2p^(Note5)

4s5p^(Note7)

UQFN040V5050

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

113.6

24.5

°C/W

Ψ_JT

UCSP55M3C

Power Dissipation^(Note3)

θ_JA

0.97

(Note 1)Based on JESD51-2A(Still-Air) only BD99954MWV

(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 3) Derate by 78.1mW/°C when operating above Ta=25°C (when mounted in ROHM’s standard board)

(Note 4)Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

70μm

Footprints and Traces

(Note 5)Using a PCB board based on JESD51-5, 7.

Layer Number of

Material

Thermal Via^(Note6)

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

Pitch

Diameter

4 Layers

FR-4

1.20mm

Φ0.30mm

Top

Bottom

Copper Pattern

Thickness

70μm

Copper Pattern

Thickness

35μm

Copper Pattern

Thickness

70μm

Footprints and Traces

74.2mm x 74.2mm

(Note 6) This thermal via connects with the copper pattern of all layers..

(Note 7)Using a PCB board

Layer Number of

Measurement Board

Material

FR-4

Board Size

63mm x 55mm x 1.6mmt

9 Layers

6. Recommended Operating Condition

MIN

3.8

MAX

Unit

VBUS

VCC

3.8

BATT

IIN

19.2

ISYS

ICHARGE

* Product structure: Silicon monolithic integrated circuit. ** This product is not designed to protect against radioactive rays.

TSZ02201-0B4B0A700040-1-2

18. Jul. 2017, Rev.001

http://www.rohm.com/

TSZ22111-14-001

7/127

1...4 5 678 9 10...130

下载PDF

与BD99954GW相关器件

型号	品牌	描述	获取价格	数据表
BD99954MWV	ROHM	BD99954MWV is a Battery Management LSI for 1-4 cell Lithium-Ion secondary battery, and ava	获取价格
BD9995NUV	ROHM	Silicon monolithic integrated circuits	获取价格
BD9995NUV_11	ROHM	Silicon monolithic integrated circuits	获取价格
BD9995NUV-TR	ROHM	Regulator, CMOS, PDSO8,	获取价格
BD9997FVT	ROHM	Silicon monolithic integrated circuits	获取价格
BD99A41F	ROHM	Voltage Detector with Watchdog Timer	获取价格

与BD99954GW相关文章

STM32H743技术深度剖析与应用案例探索
2024-05-30

15
LM321中文资料解析：引脚功能介绍、技术特点、技术特性分析
2024-05-30

15
74HC14芯片资料介绍：性能特性分析、引脚介绍
2024-05-30

13
LM1875芯片手册：功放参数分析、引脚说明、电路设计要点
2024-05-30

10

产品中心

服务支持

精选活动

关于我们

帮助中心

BD99954GW

BD99954GW 数据手册

与BD99954GW相关器件

与BD99954GW相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

BD99954GW

BD99954GW 数据手册

与BD99954GW相关器件

与BD99954GW相关文章

您还可以找

您在本页遇到什么问题？