Datasheet > BD5310G-2M

BD5310G-2M

更新时间： 2023-09-03 20:24:53

品牌	Logo	应用领域
罗姆 - ROHM		电容器
页数	文件大小	规格书
23页	2305K
描述
罗姆的延迟时间自由设置型CMOS电压检测器IC系列是内置了采用CMOS工艺的高精度、低消耗电流延迟电路的CMOS RESET IC系列。可通过外接电容器设定延迟时间。为保证客户可根据应用进行选择，备有Nch漏极开路输出(BD52xx-2M)系列和CMOS输出(BD53xx-2M)系列产品。备有检测电压为0.9V～5.0V的0.1V阶跃的产品阵容。在-40°C到105°C的整个工作温度范围内，将延迟时间精度控制在±30%内。

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BD5310G-2M 数据手册

BD52xx-2M Series BD53xx-2M Series

Absolute Maximum Ratings (Ta=+25°C)

Parameter

Symbol

Limit

-0.3 to +7

Unit

V_DD-GND

Power Supply Voltage

Nch Open Drain Output

CMOS Output

GND-0.3 to +7

GND-0.3 to V_DD+0.3

Output Voltage

Output Current

V_OUT

°C

Operating Temperature Range

Maximum Junction Temperature

Storage Temperature Range

Topr

-40 to +105

+150

Tjmax

Tstg

-55 to +150

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the

maximum junction temperature rating.

Thermal Resistance^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

SSOP5

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

376.5

185.4

°C/W

Ψ_JT

(Note 1)Based on JESD51-2A(Still-Air).

(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3)Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4)Using a PCB board based on JESD51-7.

Layer Number of

Material

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

4 Layers

FR-4

Top

Bottom

Copper Pattern

74.2mm x 74.2mm

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

70μm

www.rohm.com

TSZ02201-0GIG0G300010-1-2

05.Jul.2018 Rev.002

3/20

TSZ22111・15・001

1 234 5 6 7...23

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