Datasheet > BD2233G

BD2233G

更新时间： 2024-02-12 03:13:09

品牌	Logo	应用领域
罗姆 - ROHM		存储开关
页数	文件大小	规格书
13页	316K
描述
1ch Small Package High Side Switch ICs for USB Devices and Memory Cards

阅读下载

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

BD2233G 技术参数

生命周期：	Active	零件包装代码：	SSOP
包装说明：	LSSOP, TSOP5/6,.11,37	针数：	5
Reach Compliance Code：	compliant	风险等级：	5.67
内置保护：	OVER CURRENT; THERMAL; UNDER VOLTAGE	驱动器位数：	1
接口集成电路类型：	BUFFER OR INVERTER BASED PERIPHERAL DRIVER	JESD-30 代码：	R-PDSO-G5
长度：	2.9 mm	功能数量：	1
端子数量：	5	最高工作温度：	85 °C
最低工作温度：	-40 °C	输出特性：	OPEN-DRAIN
输出电流流向：	SINK	标称输出峰值电流：	0.5 A
封装主体材料：	PLASTIC/EPOXY	封装代码：	LSSOP
封装等效代码：	TSOP5/6,.11,37	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	认证状态：	Not Qualified
座面最大高度：	1.25 mm	最大压摆率：	0.16 mA
最大供电电压：	5.5 V	最小供电电压：	2.7 V
标称供电电压：	5 V	表面贴装：	YES
温度等级：	INDUSTRIAL	端子形式：	GULL WING
端子节距：	0.95 mm	端子位置：	DUAL
断开时间：	40 µs	接通时间：	10000 µs
宽度：	1.6 mm	Base Number Matches：	1

BD2233G 数据手册

Technical Note

BD2232G, BD2233G

●Typical Application Circuit

5V (Typ.)

10kΩ~

100kΩ

Ferrite

Beads

VIN

VOUT

/OC

Controller

GND

EN(/EN)

Fig.44 Typical application circuit

●Application Information

When excessive current flows owing to output shortcircuit or so, ringing occurs by inductance of power source line to IC,

and may cause bad influences upon IC actions. In order to avoid this case, connect a bypath capacitor CIN by VIN terminal

and GND terminal of IC. 1μF or higher is recommended. In order to decrease voltage fluctuations of power source line to IC,

connect a low ESR capacitor in parallel with CIN. 10μF ~ 100μF or higher is effective.

Pull up /OC output by resistance 10kΩ ~ 100kΩ.

Set up value which satisfies the application as CL and Ferrite Beads.

This system connection diagram doesn’t guarantee operating as the application.

When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external

components including static and transitional characteristics as well as dispersion of the IC.

●Power Dissipation Characteristic

(SSOP5 package)

700

600

500

400

300

200

100

AMBIENT TEMPERATURE : Ta [

100

125

150

]

℃

* 70mm x 70mm x 1.6mm Glass Epoxy Board

Fig.45 Power Dissipation Curve (Pd-Ta Curve)

www.rohm.com

2011.02 - Rev.A

10/12

1...7 8 91011 12 13

下载PDF

与BD2233G相关器件

型号	品牌	描述	获取价格	数据表
BD2233G-GTR	ROHM	Buffer/Inverter Based Peripheral Driver,	获取价格
BD2233G-TR	ROHM	Buffer/Inverter Based Peripheral Driver, PDSO5, SSOP-5	获取价格
BD2239N5050AHF	ANAREN	Balun 2.2GHZ-3.9GHZ 50/50 0404	获取价格
BD224	ONSEMI	TRANSISTOR TRANSISTOR,BJT,PNP,40V V(BR)CEO,5A I(C),TO-220AB, BIP General Purpose Power	获取价格
BD2240G	ROHM	1ch Small Package High Side Switch ICs for USB Devices and Memory Cards	获取价格
BD2240G_14	ROHM	1.0A Current Limit High Side Switch ICs	获取价格