BCR30FM-8LB
Preliminary
Electrical Characteristics
Parameter
Symbol
Min.
—
Typ.
—
Max.
3.0
Unit
mA
mA
V
Test conditions
Repetitive peak off-state current
IDRM
Tj = 125C, VDRM applied
Tj = 150C, VDRM applied
—
—
5.0
On-state voltage
VTM
—
—
1.5
Tc = 25C, ITM = 45 A,
instantaneous measurement
Gate trigger voltageNote2
VFGT
—
—
—
—
—
—
—
—
—
—
—
—
2.0
2.0
2.0
30
V
V
Tj = 25C, VD = 6 V, RL = 6 ,
RG = 330
VRGT
VRGT
V
Gate trigger curentNote2
IFGT
mA
mA
mA
Tj = 25C, VD = 6 V, RL = 6 ,
RG = 330
IRGT
30
IRGT
30
Gate non-trigger voltage
Thermal resistance
VGD
0.2
0.1
—
10
1
—
—
—
—
—
—
—
V
Tj = 125C, VD = 1/2 VDRM
Tj = 150C, VD = 1/2 VDRM
Junction to caseNote3
Tj = 125C
V
Rth (j-c)
3.0
—
C/W
V/s
V/s
Critical-rate of rise of off-state
commutation voltageNote4
(dv/dt)c
—
Tj = 150C
Notes: 1. Gate open.
2. Measurement using the gate trigger characteristics measurement circuit.
3. The contact thermal resistance Rth (c-f) in case of greasing is 0.5C/W.
4. Test conditions of the critical-rate of rise of off-state commutation voltage is shown in the table below.
5. Make sure that your finished product containing this device meets your safe isolation requirements.
For safety, it's advisable that heatsink is electrically floating.
Test conditions
Commutating voltage and current waveforms
(inductive load)
1. Junction temperature
Time
Supply Voltage
Tj = 125C/150C
2. Rate of decay of on-state commutating current
(di/dt)c = –16 A/ms
(di/dt)c
Time
Time
Main Current
Main Voltage
3. Peak off-state voltage
VD = 400 V
(dv/dt)c
V
D
R07DS0965EJ0001 Rev.0.01
Nov 28, 2012
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