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BCM43362KUBG PDF预览

BCM43362KUBG

更新时间: 2024-01-27 09:50:55
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 电信电信集成电路
页数 文件大小 规格书
60页 5201K
描述
Telecom Circuit, 1-Func, CMOS, PBGA69, WLBGA-69

BCM43362KUBG 技术参数

生命周期:Obsolete包装说明:VFBGA,
Reach Compliance Code:unknownECCN代码:5A992.C
HTS代码:8542.31.00.01风险等级:5.82
JESD-30 代码:R-PBGA-B69长度:4.52 mm
功能数量:1端子数量:69
最高工作温度:85 °C最低工作温度:-30 °C
封装主体材料:PLASTIC/EPOXY封装代码:VFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
座面最大高度:0.55 mm标称供电电压:1.2 V
表面贴装:YES技术:CMOS
电信集成电路类型:TELECOM CIRCUIT温度等级:OTHER
端子形式:BALL端子节距:0.4 mm
端子位置:BOTTOM宽度:2.92 mm
Base Number Matches:1

BCM43362KUBG 数据手册

 浏览型号BCM43362KUBG的Datasheet PDF文件第1页浏览型号BCM43362KUBG的Datasheet PDF文件第2页浏览型号BCM43362KUBG的Datasheet PDF文件第4页浏览型号BCM43362KUBG的Datasheet PDF文件第5页浏览型号BCM43362KUBG的Datasheet PDF文件第6页浏览型号BCM43362KUBG的Datasheet PDF文件第7页 
CYW43362  
Contents  
7.2 One-Time Programmable Memory .....................30  
7.3 GPIO Interface ...................................................30  
7.4 JTAG Interface ..................................................30  
7.5 UART Interface .................................................30  
1. Overview............................................................ 5  
1.1 Overview ............................................................. 5  
1.2 Standards Compliance ........................................ 5  
2. Power Supplies and Power Management....... 7  
2.1 WLAN Power Management ................................. 7  
2.2 Power Supply Topology ...................................... 7  
2.3 Voltage Regulators .............................................. 8  
2.4 PMU Sequencing ................................................ 8  
2.5 Low-Power Shutdown ......................................... 9  
2.6 CBUCK Regulator Features ................................ 9  
8. WLAN Software Architecture......................... 31  
8.1 Host Software Architecture ................................31  
8.2 Device Software Architecture .............................31  
8.2.1 Remote Downloader ...............................31  
8.3 Wireless Configuration Utility .............................32  
9. Pinout and Signal Descriptions..................... 32  
9.1 Signal Assignments ............................................32  
9.2 WLAN GPIO Signals and Strapping Options .....40  
3. Frequency References ................................... 10  
3.1 Crystal Interface and Clock Generation ............ 10  
3.2 TCXO ................................................................ 10  
3.3 External 32.768 kHz Low-Power Oscillator ....... 12  
10.DC Characteristics.......................................... 41  
10.1 Absolute Maximum Ratings ...............................41  
10.2 Environmental Ratings .......................................41  
10.3 Electrostatic Discharge Specifications ...............41  
4. WLAN System Interfaces ............................... 13  
4.1 SDIO v2.0 .......................................................... 13  
4.1.1 SDIO Pin Descriptions ........................... 13  
10.4 Recommended Operating Conditions and  
DC Characteristics .............................................42  
4.2 Generic SPI Mode ............................................. 14  
4.2.1 SPI Protocol ........................................... 15  
4.2.1.1.Command Structure ...................... 17  
4.2.1.2.Write .............................................. 17  
4.2.1.3.Write/Read ..................................... 17  
4.2.1.4.Read .............................................. 17  
4.2.1.5.Status ............................................ 17  
4.2.2 gSPI Host-Device Handshake ............... 19  
4.2.3 Boot-Up Sequence ................................ 20  
11.WLAN RF Specifications................................ 43  
11.1 2.4 GHz Band General RF Specifications ..........43  
11.2 WLAN 2.4 GHz Receiver Performance  
Specifications .....................................................43  
11.3 WLAN 2.4 GHz Transmitter Performance  
Specifications .....................................................46  
11.4 General Spurious Emissions Specifications .......47  
4.3 External Coexistence Interface ........................ 22  
12.Internal Regulator Electrical S  
5. Wireless LAN MAC and PHY.......................... 24  
pecifications.................................................... 48  
5.1 MAC Features ................................................... 24  
5.1.1 MAC Description .................................... 24  
5.1.1.1.PSM ............................................... 25  
5.1.1.2.WEP .............................................. 25  
5.1.1.3.TXE ................................................ 25  
5.1.1.4.RXE ............................................... 25  
5.1.1.5.IFS ................................................. 26  
5.1.1.6.TSF ................................................ 26  
5.1.1.7.NAV ............................................... 26  
5.1.1.8.MAC-PHY Interface ....................... 26  
12.1 Core Buck Regulator ..........................................48  
12.2 3.3V LDO (LDO3P3) ..........................................50  
12.3 CLDO .................................................................50  
12.4 LNLDO1 .............................................................51  
13.System Power Consumption......................... 52  
14.Interface Timing and AC Characteristics ..... 53  
14.1 SDIO Default Mode Timing ................................53  
14.2 SDIO High-Speed Mode Timing .........................54  
14.3 gSPI Signal Timing .............................................55  
14.4 JTAG Timing ......................................................55  
5.2 PHY Description ................................................ 26  
5.2.1 PHY Features ........................................ 26  
6. WLAN Radio Subsystem................................ 29  
6.1 Receive Path ..................................................... 29  
6.2 Transmit Path .................................................... 29  
6.3 Calibration ......................................................... 29  
15.Package Information ...................................... 56  
15.1 Package Thermal Characteristics ......................56  
15.1.1 Junction Temperature Estimation and  
PSI Versus Thetajc ..................................56  
7. CPU and Global Functions............................. 30  
7.1 WLAN CPU and Memory Subsystem ............... 30  
Document No. 002-14779 Rev. *G  
Page 3 of 60  

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