BAS16WT1G, SBAS16WT1G
Silicon Switching Diode
Features
• AEC−Q101 Qualified and PPAP Capable
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
http://onsemi.com
3
1
CATHODE
ANODE
MAXIMUM RATINGS (T = 25°C)
A
MARKING
DIAGRAM
Rating
Symbol
Value
75
Unit
V
Continuous Reverse Voltage
Recurrent Peak Forward Current
V
I
R
200
500
mA
mA
A6 MG
R
SC−70
CASE 419
STYLE 2
G
Peak Forward Surge Current
Pulse Width = 10 ms
I
FM(surge)
1
Total Power Dissipation,
One Diode Loaded T = 25°C
P
D
200
1.6
mW
A
A6
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
Derate above 25°C
Mounted on a Ceramic Substrate
(10 x 8 x 0.6 mm)
mW/°C
(*Note: Microdot may be in either location)
Operating and Storage Junction
Temperature Range
T , T
−55 to
+150
°C
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
†
Device
Package
Shipping
BAS16WT1G
SC−70
(Pb−Free)
3000 / Tape & Reel
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
SBAS16WT1G
SC−70
(Pb−Free)
3000 / Tape & Reel
Thermal Resistance,
Junction−to−Ambient
One Diode Loaded
Mounted on a Ceramic Substrate
(10 x 8 x 0.6 mm)
R
625
°C/W
q
JA
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
October, 2011− Rev. 9
BAS16WT1/D