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BA1033F PDF预览

BA1033F

更新时间: 2022-12-17 02:36:54
品牌 Logo 应用领域
罗姆 - ROHM /
页数 文件大小 规格书
20页 459K
描述
Comparators : Ground Sense

BA1033F 数据手册

 浏览型号BA1033F的Datasheet PDF文件第14页浏览型号BA1033F的Datasheet PDF文件第15页浏览型号BA1033F的Datasheet PDF文件第16页浏览型号BA1033F的Datasheet PDF文件第18页浏览型号BA1033F的Datasheet PDF文件第19页浏览型号BA1033F的Datasheet PDF文件第20页 
BA10393F,BA10339F/FV,BA2903SF/FV/FVM,BA2903F/FV/FVM,  
BA2903HFVM-C,BA2901SF/FV/KN,BA2901F/FV/KN  
Technical Note  
Precautions  
1) Unused circuits  
VCC  
When there are unused circuits it is recommended that they beconnected as  
in Fig.93, setting the non-inverting input terminal to a potential within the in-phase  
input voltage range (VICR).  
OPEN  
Please keep this  
2) Input terminal voltage  
potencial in Vicm  
(BA2903S/BA2903/BA2901S/BA2901 family, BA2903HFVM-C)Applying  
VEE + 36Vto the input terminal is possible without causing deterioration of  
the electrical characteristics or destruction, irrespective of the supply voltage.  
However,this does not ensure normal circuit operation.  
VEE  
Please note that the circuit operates normally only when the input voltage is  
within the common mode input voltage range of the electric characteristics.  
Fig.93 Disable circuit example  
3) Power supply (single / dual)  
The op-amp operates when the specified voltage supplied is between VCC and VEE. Therefore, the single supply op-amp  
can be used as a dual supply op-amp as well.  
4) Power dissipation Pd  
Using the unit in excess of the rated power dissipation may cause deterioration in electrical characteristics due to a rise in  
chip temperature, including reduced current capability.  
Therefore, please take into consideration the power dissipation (Pd) under actual operating conditions and apply a  
sufficient margin in thermal design. Refer to the thermal derating curves for more information.  
5) Short-circuit between pins and erroneous mounting  
Incorrect mounting may damage the IC. In addition, the presence of foreign particles between the outputs, the output and  
the power supply, or the output and GND may result in IC destruction.  
6) Terminal short-circuits  
When the output and VCC terminals are shorted, excessive output current may flow, resulting in undue heat generation  
and, subsequently, destruction.  
7) Operation in a strong electromagnetic field  
Operation in a strong electromagnetic field may cause malfunctions.  
8) Radiation  
This IC is not designed to withstand radiation.  
9) IC handing  
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical  
characteristics due to piezoelectric (piezo) effects.  
10) Board inspection  
Connecting a capacitor to a pin with low impedance may stress the IC.  
Therefore, discharging the capacitor after every process is recommended. In addition, when attaching and detaching  
the jig during the inspection phase, ensure that the power is turned off before inspection and removal .  
Furthermore, please take measures against ESD in the assembly process as well as during transportation and storage.  
www.rohm.com  
© 2010 ROHM Co., Ltd. All rights reserved.  
2010.05 - Rev.B  
17/19  

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