●Block Diagrams
BA□□CC0WFP/ BA□□DD0WHFP/ BA□□CC0WT(V5)/ BA□□DD0WT
GND
(TO252-5・HRP5)
TOP VIEW
Fin
Vcc
FIN
PIN No.
Pin Name
CTL
Function
Output voltage ON/OFF control
Power supply voltage input
Unconnected terminal/GND
Voltage output
Driver
Vref
1
2
R2
R1
Vcc
1
2
3 4 5
1 2 3 4 5
HRP5
1
3
N.C/GND
OUT
*
TO252-5
TOP VIEW
TOP VIEW
4
OVP
2
TSD
OCP
5
N.C
Unconnected terminal
GND
2
Fin
GND
*
3
4
1
5
*1 TO252-5 is N.C.,and TO220FP-5,-5(V5),and HRP5 are GND
*2 Only for TO252-5 and HRP5
CTL
Vcc
N.C.
OUT
N.C.
(TO252-5)
GND
(TO220FP-5,-5(V5),HRP5)
1 2 345
1 2 345
TO220FP-5
TO220FP-5(V5)
Fig.25
BA□□CC0T/ BA□□CC0FP/ BA□□DD0T
GND
(TO252-3)
Fin
Vcc
TOP VIEW
FIN
TOP VIEW
Driver
Vref
PIN No.
Pin Name
Vcc
Function
R2
R1
1
2
Power supply voltage input
N.C/GND
OUT
Unconnected terminal/GND*1
3
Voltage output
OVP
TSD
OCP
1
2
3
2
Fin
GND
GND
*
1
2 3
TO252-3
TO220FP-3
*1 TO252-3 is N.C.,and TO-220FP-3,is GND
*2 Only for TO252-3 and HRP5
1
3
2
Vcc
N.C.
(TO252-3)
GND
(TO220FP-3)
OUT
Fig.26
●Input / Output Equivalent Circuit Diagrams
<
BA□□DD0 Series
>
<
BA□□CC0 Series
>
Vcc
Vcc
Vcc
25kΩ
10kΩ
CTL
OUT
39kΩ 2kΩ
31kΩ
CTL
OUT
25kΩ
R2
R1
R2
R1
Fig.27
Fig.28
●Thermal Design
HRP-5
TO220FP-5
TO252-5
2.0
10
25
20
15
10
5
Board size : 70×70×1.6 ㎜3 (board contains a thermal via)
Board front copper foil area : 10.5×10.5 ㎜2
(1) When using a maximum heat sick : θj-c=6.25(℃/W)
(2) When using an IC alone : θj-6=62.5(℃/W)
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
9
8
7
6
5
4
3
2
1
0
①2-layer board (back surface copper foil area :15×15 ㎜2
②2-layer board (back surface copper foil area :70×70 ㎜2
③4-layer board (back surface copper foil area :70×70 ㎜2
)
)
)
TO252-5θja=96.2(℃/W)
1.6
1.2
0.8
0.4
0.0
(1)20.0
③7.3W
1.30
②5.5W
①2.3W
(2)2.0
0
0
25
50
75
100
125
150
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Ambient temperature:Ta(℃)
Ambient temperature:Ta(℃)
Ambient temperature:Ta(℃)
Fig.29
Fig.30
Fig.31
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.29 through 31. The IC
characteristics are closely related to the temperature at which the IC is used and if the temperature exceeds the maximum
junction temperature TjMAX., the elements may be damaged or destroyed. From the standpoints of instantaneous destruction and
long-term operating reliability, it is necessary give sufficient consideration to IC heat. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures lower than the maximum junction temperature TjMAX of the IC.
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