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BA033CC0T-V5 PDF预览

BA033CC0T-V5

更新时间: 2024-01-14 10:00:18
品牌 Logo 应用领域
罗姆 - ROHM /
页数 文件大小 规格书
9页 1092K
描述
Fixed Positive LDO Regulator, 3.3V, LEAD FREE, TO-220FP, 3 PIN

BA033CC0T-V5 数据手册

 浏览型号BA033CC0T-V5的Datasheet PDF文件第2页浏览型号BA033CC0T-V5的Datasheet PDF文件第3页浏览型号BA033CC0T-V5的Datasheet PDF文件第4页浏览型号BA033CC0T-V5的Datasheet PDF文件第6页浏览型号BA033CC0T-V5的Datasheet PDF文件第7页浏览型号BA033CC0T-V5的Datasheet PDF文件第8页 
Block Diagrams  
BA□□CC0WFP/ BA□□DD0WHFP/ BA□□CC0WT(V5)/ BA□□DD0WT  
GND  
(TO252-5HRP5)  
TOP VIEW  
Fin  
Vcc  
FIN  
PIN No.  
Pin Name  
CTL  
Function  
Output voltage ON/OFF control  
Power supply voltage input  
Unconnected terminal/GND  
Voltage output  
Driver  
Vref  
1
2
R2  
R1  
Vcc  
1
2
3 4 5  
1 2 3 4 5  
HRP5  
1
3
N.C/GND  
OUT  
*
TO252-5  
TOP VIEW  
TOP VIEW  
4
OVP  
2
TSD  
OCP  
5
N.C  
Unconnected terminal  
GND  
2
Fin  
GND  
*
3
4
1
5
1 TO252-5 is N.C.,and TO220FP-5,-5(V5),and HRP5 are GND  
2 Only for TO252-5 and HRP5  
CTL  
Vcc  
N.C.  
OUT  
N.C.  
(TO252-5)  
GND  
(TO220FP-5,-5(V5),HRP5)  
1 2 345  
1 2 345  
TO220FP-5  
TO220FP-5V5)  
Fig.25  
BA□□CC0T/ BA□□CC0FP/ BA□□DD0T  
GND  
(TO252-3)  
Fin  
Vcc  
TOP VIEW  
FIN  
TOP VIEW  
Driver  
Vref  
PIN No.  
Pin Name  
Vcc  
Function  
R2  
R1  
1
2
Power supply voltage input  
N.C/GND  
OUT  
Unconnected terminal/GND*1  
3
Voltage output  
OVP  
TSD  
OCP  
1
2
3
2
Fin  
GND  
GND  
*
1
2 3  
TO252-3  
TO220FP-3  
1 TO252-3 is N.C.,and TO-220FP-3,is GND  
2 Only for TO252-3 and HRP5  
1
3
2
Vcc  
N.C.  
(TO252-3)  
GND  
(TO220FP-3)  
OUT  
Fig.26  
Input / Output Equivalent Circuit Diagrams  
<
BA□□DD0 Series  
>
<
BA□□CC0 Series  
>
Vcc  
Vcc  
Vcc  
25kΩ  
10kΩ  
CTL  
OUT  
39kΩ 2kΩ  
31kΩ  
CTL  
OUT  
25kΩ  
R2  
R1  
R2  
R1  
Fig.27  
Fig.28  
Thermal Design  
HRP-5  
TO220FP-5  
TO252-5  
2.0  
10  
25  
20  
15  
10  
5
Board size : 70×70×1.6 3 board contains a thermal via)  
Board front copper foil area : 10.5×10.5 2  
1When using a maximum heat sick : θj-c=6.25(/W)  
2When using an IC alone : θj-6=62.5(/W)  
Mounted on a Rohm standard board  
Board size : 70×70×1.6 ㎜  
Copper foil area :7×7 ㎜  
9
8
7
6
5
4
3
2
1
0
2-layer board (back surface copper foil area :15×15 2  
2-layer board (back surface copper foil area :70×70 2  
4-layer board (back surface copper foil area :70×70 2  
)
)
)
TO252-5θja=96.2(/W)  
1.6  
1.2  
0.8  
0.4  
0.0  
120.0  
7.3W  
1.30  
5.5W  
2.3W  
22.0  
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
Ambient temperature:Ta(℃)  
Ambient temperature:Ta(℃)  
Ambient temperature:Ta(℃)  
Fig.29  
Fig.30  
Fig.31  
When using at temperatures over Ta=25, please refer to the heat reducing characteristics shown in Fig.29 through 31. The IC  
characteristics are closely related to the temperature at which the IC is used and if the temperature exceeds the maximum  
junction temperature TjMAX., the elements may be damaged or destroyed. From the standpoints of instantaneous destruction and  
long-term operating reliability, it is necessary give sufficient consideration to IC heat. In order to protect the IC from thermal  
damage, it is necessary to operate it at temperatures lower than the maximum junction temperature TjMAX of the IC.  
5/8  

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