Multilayer varistors (MLVs)
Low capacitance series
Features
Single chip
ESD protection level acc. ISO 10605, IEC 61000-4-2
Level 4
Internal circuit
Bidirectional protection
Low capacitance
Low insertion loss
Low leakage current
No signal distortion
RoHS-compatible
Available case sizes:
Suitable for lead-free soldering
PSpice simulation models available
Customer-specific types on request
EIA
Metric
0603
0805
1608
2012
Applications
ESD protection of data lines e.g. in notebooks and
portable devices
Array
Internal circuit
Design
Multilayer technology
Lack of plastic or epoxy encapsulation for
flammability rating better than UL 94 V-0
Termination (see “Soldering directions”):
2-fold array
4-fold array
ꢁ
CT and CA types with nickel barrier terminations
(AgNiSn), recommended for lead-free soldering,
and compatible with tin/lead solder.
Available case sizes:
EIA
Metric
1014
1632
Version
V/I characteristics and derating curves
0405
0612
2-fold array
4-fold array
V/I and derating curves are attached to the data sheet.
The curves are sorted by VRMS and then by case size,
which is included in the type designation.
Please read Cautions and warnings and
Important notes at the end of this document.
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