Datasheet > B58601E3265B711

B58601E3265B711

更新时间： 2024-03-03 10:09:11

品牌	Logo	应用领域
东电化 - TDK		/
页数	文件大小	规格书
10页	451K
描述
Pressure sensor die, open bridge, high TCR

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B58601E3265B711 数据手册

Important notes

8. The trade names EPCOS, CarXield, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas,

CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell,

MKD, MKK, ModCap, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap,

PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV,

ThermoFuse, WindCap, XieldCap are trademarks registered or pending in Europe and in other

countries.

Further

information

will

found

the

Internet

www.tdk-electronics.tdk.com/trademarks.

Release 2020-06

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型号	品牌	获取价格	描述	数据表
B58601E3284B615	TDK	获取价格	Pressure sensor die, open bridge
B58601E3284B646	TDK	获取价格	Pressure sensor die, open bridge
B58601E3284B709	TDK	获取价格	Pressure sensor die, open bridge, high TCR
B58601E3284B711	TDK	获取价格	Pressure sensor die, open bridge, high TCR
B58601E3513B708	TDK	获取价格	Pressure sensor die, low pressure
B58601E3513B709	TDK	获取价格	Pressure sensor die, low pressure, high TCR
B58601E3513B710	TDK	获取价格	Pressure sensor die, low pressure
B58601E3513B711	TDK	获取价格	Pressure sensor die, low pressure, high TCR
B58601E3815B650	TDK	获取价格	Peizoresistive Sensor
B58601E3845B650	TDK	获取价格	Pressure sensor die, bond pads on one side